IGEP COM MODULE

Small module SINGLE core ARM Cortex-A8 up to 1000 MHz

The IGEP COM MODULE is an industrial processor board. It can be used as a computer-on-module for your product. The IGEP COM MODULE provides a lot of features in a small size. You can build your project anywhere you want.

Features
Processor	DM3730 / AM3703, by Texas Instruments ARM Cortex-A8 NEON SIMD Coprocessor Frequency speed 1000 MHz TMS320C64+ DSP 800 MHz (Only in DM3730 version)
3D/2D Accelerator	PowerVR SGX GPU, providing graphics acceleration with OpenGL ES1.0, OpenGL ES2.0 and OpenVG support (Only in DM3730 version)
Video	Video acceleration: H.264, H.263, MPEG-4, MPEG-2, JPEG, WMV9 and additional codecs. Video encoder/decoder up to 720p (Only in DM3730 version)
Memory	RAM: Up to 512 MB Mobile DDR (Standard setup 512 MB) Flash: Up to 512 MB (Standard setup 512 MB) Onboard micro-SD card socket
Ethernet	No
USB	1 x USB 2.0 Host (connector not included) 1 x USB 2.0 OTG
Display	1 x Digital Video/TFT interface Resolution 2048 x 2048 – 24 bits 1 x Analog S-Video interface (Optional)
Image Capture Interface	1 x CPI interface (12 bits)
Wireless	WiFi IEEE 802.11 b/g/n (Access Point: Yes) Bluetooth v4.0 (BLE)
Antenna	1 x Internal WiFi/Bluetooth antenna 1 x U.FL connector for external antenna
Additional Interfaces (Other combinations available, see Hardware Manual for more information)	4 x UART 1 x I2C 1 x MMC (No WiFi version) 1 x I2S 1 x GPMC 1 x Analog Audio In 1 x Audio Out 2 x SPI 76 x GPIO (Maximum number of GPIOs) 5 x Analog-to-Digital Converter 4 x PWM
SW Support	Linux Android
Power Supply	Power from expansion connectors: From 3,5 V to 4,2 V Digital I/O voltage: 1,8 V
Power Consumption	Typical 1 W (depending on software) Maximum 2 W (depending on software)
Thermal	Commercial temperature: 0 ºC to +60 ºC Industrial temperature: -40 ºC to +85 ºC
Form Factor	18 mm x 68.5 mm Gumstix compatible
Humidity	93% relative Humidity at 40 ºC, non-condensing (according to IEC 60068-2-78)
MTBF	> 100000 hours

Options
Processor	DM3730, by Texas Instruments AM3703, by Texas Instruments ARM Cortex-A8 Frequency speed 1000 MHz
Grade	Commercial temperature: 0 ºC to +60 ºC Industrial temperature: -40 ºC to +85 ºC
Main Memory	256 MB Mobile DDR 512 MB Mobile DDR
Flash Memory	No flash 256 MB 512 MB
Wireless	No WiFi/Bluetooth WiFi IEEE 802.11 b/g/n (Access Point: Yes) Bluetooth v4.0 (BLE)
3D/2D Accelerator - Video	Only DM3730

Documentation

• IGEP COM MODULE SoC: DM3730
• Datasheet
• Mechanical
• Software Manual
• Hardware Manual

Tutorials

If you are new with following concepts we recommend you to complete the tutorials in order !

1. IGEP COM MODULE Boot Pin-out
2. How to prepare a ready to boot firmware
3. U-Boot Bootloader
4. Linux Kernel
5. IGEP Firmware set-up
6. Boot from MicroSD Card
7. Boot from NAND/eMMC flash.
8. Update Installed IGEP Firmware

Firmware

Official

• Official IGEP Firmware

Custom Software

• Ubuntu Xenial 16.04 LTS ARM Hard Float
• Debian Stretch ARM Hard Float
• Yocto Pyro ARM Hard Float
• Buildroot ARM Hard Float

Guides

Getting started with IGEP COM MODULE

• Getting Started with IGEP COM MODULE

Ubuntu / Debian

• How To Set Up an NFS Mount on Ubuntu 16.04

Yocto

• How to use the Yocto Project to develop Embedded Linux