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| − | = IGEP module<br> =
| + | #REDIRECT:[[IGEP COM MODULE]] |
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| − | [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] is the new computer on module designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE] for industrial and commercial market. It's low cost, high performance and production ready module.
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| − | [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard. <br>
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| − | You don't need anything else than a USB cable to power the [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] and communicate with it by using [http://en.wikipedia.org/wiki/USB_OTG USB OTG] interface or [http://en.wikipedia.org/wiki/Wi-Fi wifi]/[http://en.wikipedia.org/wiki/Bluetooth bluetooth] interface.
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| − | [[Image:IGEP_module.jpg|center]]<br>
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| − | == Module Features<br> ==
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| − | *[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] pin compatible family multicore processor.
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| − | *Processors Available OMAP3503, OMAP3515, OMAP3525, [[../../../../index.php/OMAP3530|OMAP3530]], DM3703, DM3715.<br>
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| − | *ARM CORTEX A8 core up to 1 Ghz.<br>
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| − | *DSP TMS320C64x+ core up to 800 Mhz.<br>
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| − | *POWERVR SGX 530 core up to 200 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)
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| − | *IVA2.2 (Video Hardware Accelerators)
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| − | *[[../../../../index.php/TPS65950|TPS65950]] Power Management
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| − | *DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
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| − | *Memory densities available:<br>
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| − | #128MByte RAM and 256MByte OneNAND flash<br>
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| − | #256MByte RAM and 512MByte OneNAND flash [[|]]<br>
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| − | #512MByte RAM and 512MByte OneNAND flash <br>
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| − | *Linux BSP available (Board Support Package) and Windows CE (Under Development, Available OCT/2010).
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| − | *WIFI IEEE 802.11b/g + Bluetooth 2.0 (Integrated antenna).
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| − | *<br>
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| − | Processor: OMAP3503 and OMAP3530. Applications Processor with ARM Cortex-A8 CPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration
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| − | ** Memory: <br> o 128MByte RAM and 256MByte OneNAND flash<br> o 512MByte RAM and 512MByte OneNAND flash<br> * On board microSD slot<br> * On board USB 2.0 OTG miniAB socket for power and data<br> * On board USb 2.0 Host interface<br> * Features<br> o I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> o Headset, Microphone, backup battery<br> o USB OTG signals, USB HS Host<br> * Wireless<br> o Wifi 802.11 b/g<br> o Bluetooth 2.0<br> * Connections<br> o 2 x 70-pin PCB to PCB connector<br> o 2 x 27-pin flex ribbon connector<br> * Size: 18 x 68mm
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| − | IGEP MODULE will be offered in various configurations:
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| − | *OMAP3530 + wifi + bluetooth + 4GBit RAM + 4GBit ONENAND FLASH<br> * OMAP3530 + 4GBit RAM + 4GBit ONENAND FLASH<br> * OMAP3503 + wifi + bluetooth + 1GBit RAM + 2GBit ONENAND FLASH<br> * OMAP3503 + 1GBit RAM + 2GBit ONENAND FLASH
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| − | Prices and availability will be available soon.
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| − | Find preliminary specification here.
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| − | Please do not hesitate to contact ISEE Sales ( sales@iseebcn.comThis e-mail address is being protected from spambots. You need JavaScript enabled to view it ) for any question.<br>
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