Difference between revisions of "IGEP0020 Features"

From IGEP - ISEE Wiki

Jump to: navigation, search
Line 107: Line 107:
  
 
*TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core ('''720Mhz''') + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ ('''520Mhz''')  
 
*TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core ('''720Mhz''') + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ ('''520Mhz''')  
*TI DM3730: ARM CORTEX A8 core ('''from 800MHz to 1Ghz''') + + POWERVR SGX 530 core ('''200Mhz''') + IVA2.2 + DSP TMS320C64x+ ('''800Mhz''') <br>
+
*TI DM3730: ARM CORTEX A8 core ('''from 800MHz to 1Ghz''') + + POWERVR SGX 530 core ('''200Mhz''') + IVA2.2 + DSP TMS320C64x+ ('''800Mhz''') <br>  
 
*[[TPS65950|TPS65950]] power managment.  
 
*[[TPS65950|TPS65950]] power managment.  
 
*'''4Gb NAND/ 4Gb''' Mobile Low Power DDR SDRAM @ '''200Mhz''' (Package on Package - PoP technology)  
 
*'''4Gb NAND/ 4Gb''' Mobile Low Power DDR SDRAM @ '''200Mhz''' (Package on Package - PoP technology)  
Line 134: Line 134:
 
*Released on March 2010.
 
*Released on March 2010.
  
<br>
+
<br>
 +
 
 +
=== Revision C - OMAP35xx &amp; DM37xx Compatible<br>  ===
 +
 
 +
*Compatible with OMAP35xx and DM37xx processor families.
 +
*TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core ('''720Mhz''') + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ ('''520Mhz''')
 +
*TI DM3730: ARM CORTEX A8 core ('''from 800MHz to 1Ghz''') + + POWERVR SGX 530 core ('''200Mhz''') + IVA2.2 + DSP TMS320C64x+ ('''800Mhz''') <br>
 +
*[[TPS65950|TPS65950]] power managment.
 +
*4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
 +
*Ethernet 10/100 Mb BaseT ([http://www.smsc.com/ SMSC] [http://www.smsc.com/index.php?tid=145&pid=116 LAN9221i]) with MAC EEPROM [optional]
 +
*[http://en.wikipedia.org/wiki/IEEE_802.11 Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA)
 +
*[http://en.wikipedia.org/wiki/Bluetooth Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e)
 +
*Integrated antenna and connector for external antenna.
 +
*1 x [http://en.wikipedia.org/wiki/USB_OTG USB OTG]
 +
*1 x [http://en.wikipedia.org/wiki/USB USB ]2.0 Host<br>
 +
*MicroSD connector.
 +
*[http://en.wikipedia.org/wiki/DVI-D DVI-D] for connecting digital computer monitors.
 +
*Stereo audio in and out for a microphone and headphones or speakers.
 +
*Expansion connector with I/O, SPI, UART...
 +
*Expansion connector with TFT + SPI for touch control.<br>
 +
*[[TPS65950#Subsystems|Keypad connector]].<br>
 +
*Expansion connector with ISP.<br>
 +
*2 ADC 1 and 3 MSP [Optional].
 +
*Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
 +
*RS-485 Transceiver / RS-232 Transceiver.
 +
*RS-232 Transceiver - [[Serial Debug Console|Serial Debug Console]].
 +
*RTC Battery backup.<br>
 +
*Temperature Range: -40 to +80º C.
 +
*EMI and EMC pre-certificate. CE compliant.<br>
 +
*[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2/HW_User_Manuals Hardware Reference Manual revision 1.15].
 +
*[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2/HW_Mechanical Mechanical Dimensions].
 +
*It will be Released on October 2010.
 +
 
 +
<br>  
  
 
=== Revision C - OMAP35xx &amp; DM37xx Compatible<br>  ===
 
=== Revision C - OMAP35xx &amp; DM37xx Compatible<br>  ===
Line 167: Line 200:
 
*It will be Released on 1Q 2011.
 
*It will be Released on 1Q 2011.
  
<br>
+
<br>  
 
 
 
= IGEPv2 Industrial Applications  =
 
= IGEPv2 Industrial Applications  =
  

Revision as of 18:01, 9 October 2010

IGEPv2 Board

IGEPv2 BOARD is a low-cost, fan-less single board computer that unleashes laptop-like performance and expandability without the bulk, expense, or noise of typical desktop machines.

IGEPv2 board Revision C

Platform Features

  • TI OMAP35x pin compatible family multicore processor.
  • Processors Available OMAP3503, OMAP3515, OMAP3525, OMAP3530.
  • ARM CORTEX A8 core up to 720 Mhz.
  • DSP TMS320C64x+ core up to 520 Mhz.
  • POWERVR SGX 530 core up to 110 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)
  • IVA2.2 (Video Hardware Accelerators)
  • TPS65950 Power Management
  • DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
  • Linux BSP available (Board Support Package) and Windows CE (Under Development).
  • Ethernet 10/100 Mb BaseT - with EEPROM as option.
  • Wifi IEEE 802.11b/g + Bluetooth 2.0 (Integrated antenna).
  • Compatibility with a huge collection of USB peripherals including hubs, keyboards, mice, web cameras, and much more.
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with access LCD lines.
  • Expansion connector with access ISP lines.
  • Keypad connector.
  • RTC Battery backup.
  • JTAG Expansion Connector.
  • Wall plug 5 VDC/1A or JST input.
  • 3 UARTS Available.
  • 1 Serial Debug Console Port.
  • 2 ADC : 1 and 3 MSP/s.
  • Temperature Range: -40 to +80º C (See availablitity models).
  •  EMI and EMC precertificate. CE compliant.
  • Small form factor.


IGEPv2 BOARD Features

Revision A

  • TI OMAP3530: ARM CORTEX A8 core (500 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (330Mhz)
  • TPS65950 power managment
  • 2Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 166 Mhz (Package on Package - PoP technology)
  • Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • 1 x USB OTG
  • 1 x USB 2.0 Host
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT + SPI for touch control.
  • Keypad connector.
  • 2 ADC 1 and 3 MSP.
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
  • RS-485 Transceiver.
  • RS-232 Transceiver - Serial Debug Console.
  • Temperature Range: -40 to +80º C.
  • EMI and EMC certificate. CE compliant.
  • Expansion Board:
  1. TFT 7" Hitachi (TX18D35VM0APA) + Touch Screen + backlight.
  2. GSM/GPRS Telit GE864 - QUAD BAND
  3. ST - GPS (Information Under NDA)
  4. Battery ION-Li powered (charger, battery management)
  • Only available for medium/high volume customers.
  • Released on November 2008.


Revision B

  • TI OMAP3530: ARM CORTEX A8 core (600/720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (330/520Mhz)
  • TPS65950 power managment
  • 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
  • Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • 1 x USB OTG
  • 1 x USB 2.0 Host
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT + SPI for touch control.
  • Keypad connector.
  • 2 ADC 1 and 3 MSP [Optional].
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
  • RS-485 Transceiver.
  • RS-232 Transceiver - Serial Debug Console.
  • Temperature Range: -40 to +80º C.
  • EMI and EMC pre-certificate. CE compliant.
  • Hardware Reference Manual revision 1.13.
  • Mechanical Dimensions.
  • Released on May 2009.


Revision C

  • TI OMAP3530: ARM CORTEX A8 core (720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
  • TI DM3730: ARM CORTEX A8 core (from 800MHz to 1Ghz) + + POWERVR SGX 530 core (200Mhz) + IVA2.2 + DSP TMS320C64x+ (800Mhz)
  • TPS65950 power managment.
  • 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
  • Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • 1 x USB OTG
  • 1 x USB 2.0 Host
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT + SPI for touch control.
  • Keypad connector.
  • Expansion connector with ISP.
  • 2 ADC 1 and 3 MSP [Optional].
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
  • RS-485 Transceiver / RS-232 Transceiver.
  • RS-232 Transceiver - Serial Debug Console.
  • RTC Battery backup.
  • Temperature Range: -40 to +80º C.
  • EMI and EMC pre-certificate. CE compliant.
  • Hardware Reference Manual revision 1.15.
  • Mechanical Dimensions.
  • Released on March 2010.


Revision C - OMAP35xx & DM37xx Compatible

  • Compatible with OMAP35xx and DM37xx processor families.
  • TI OMAP3530: ARM CORTEX A8 core (720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
  • TI DM3730: ARM CORTEX A8 core (from 800MHz to 1Ghz) + + POWERVR SGX 530 core (200Mhz) + IVA2.2 + DSP TMS320C64x+ (800Mhz)
  • TPS65950 power managment.
  • 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
  • Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • 1 x USB OTG
  • 1 x USB 2.0 Host
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT + SPI for touch control.
  • Keypad connector.
  • Expansion connector with ISP.
  • 2 ADC 1 and 3 MSP [Optional].
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
  • RS-485 Transceiver / RS-232 Transceiver.
  • RS-232 Transceiver - Serial Debug Console.
  • RTC Battery backup.
  • Temperature Range: -40 to +80º C.
  • EMI and EMC pre-certificate. CE compliant.
  • Hardware Reference Manual revision 1.15.
  • Mechanical Dimensions.
  • It will be Released on October 2010.


Revision C - OMAP35xx & DM37xx Compatible

  • Compatible with OMAP35xx and DM37xx processor families.
  • TI OMAP3530: ARM CORTEX A8 core (720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
  • TI DM3730: ARM CORTEX A8 core (from 800MHz to 1Ghz) + + POWERVR SGX 530 core (200Mhz) + IVA2.2 + DSP TMS320C64x+ (800Mhz)
  • TPS65950 power managment.
  • 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
  • Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • 1 x USB OTG
  • 1 x USB 2.0 Host
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT + SPI for touch control.
  • Keypad connector.
  • Expansion connector with ISP.
  • 2 ADC 1 and 3 MSP [Optional].
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
  • RS-485 Transceiver / RS-232 Transceiver.
  • RS-232 Transceiver - Serial Debug Console.
  • RTC Battery backup.
  • Temperature Range: -40 to +80º C.
  • EMI and EMC pre-certificate. CE compliant.
  • Hardware Reference Manual revision 1.15.
  • Mechanical Dimensions.
  • It will be Released on 1Q 2011.


IGEPv2 Industrial Applications

24 Ghz Radar


Expansion Board

  • Modem GSM/GPRS based on TELIT GE865 module with SIMCARD connector and external cable Antenna.
  • LCD and touch interface for 7.0 inch SEIKO LCD: 3 connectors (40pin FFC for TFT interface + 4pin FFC for touch + 6pin FFC for LED backlight).
  • LCD and touch interface for 4.3 inch POWERTIP LCD: 40pin FFC for TFT interface, touch and LED backlight).
  • VGA interface on D-SUB15 connector.
  • 2 x video composite inputs on RCA connector. Video Decoder based on TEXAS Video Decoder TVP5150.
  • Camera interface for e-con Systems e-CAM32_OMAP module.
  • CAN bus interface with 3 pin connector. CAN interface based on MICROCHIP MCP2515 CAN controller.
  • LVDS video serializer (MAX9247).
  • RS232 - Serial port on DB9 connector.
  • Size: idem IGEPv2.


IGEPv2 Expansion board and LCD displays (7.0' and 4.3') will be available on online store in different configurations:

  • IGEPv2 Exp. Board - Network: Modem GSM/GPRS + CAN interface + DB9 connector
  • IGEPv2 Exp. Board - Multimedia: VGA + LCD interface + Video Inputs + Camera interface
  • IGEPv2 Exp. Board - Full: all interfaces.

Expansion Board schematics, mechanical drawing and bill of materials will be public.