Difference between revisions of "IGEP0020 Features"

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*Released on October 2010.
 
*Released on October 2010.
  
[[Category:IGEP0020]]
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[[Category:Features]]

Revision as of 10:19, 30 April 2012

Revision C

IGEP0020 is based on OMAP35xx and DM37xx

IGEPv2 board Revision C


Processor and memory

  • Texas Instruments OMAP3530: ARM CORTEX A8 core (720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
  • TI DM3730: ARM CORTEX A8 core (from 800MHz to 1Ghz) + + POWERVR SGX 530 core (200Mhz) + IVA2.2 + DSP TMS320C64x+ (800Mhz)
  • TPS65950 power managment
  • 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)


Features

  • Stereo audio in and out for a microphone and headphones or speakers


Expandability

  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT Screen + SPI for touch screens control
  • Keypad connector
  • Expansion connector with ISP
  • 2 x ADC 1 and 3 MSP [Optional]
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector)


Temperatures

  • Temperature Range: -40 to +80º C.


Legal

  • EMI and EMC pre-certificate. CE compliant
  • Released on October 2010.