Difference between revisions of "IGEP0020 Features"

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= IGEPv2 Board =
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== IGEPv2 Board Features ==
  
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[http://www.igep.es/index.php?option=com_content&view=article&id=46&Itemid=55 IGEPv2 BOARD] is a '''low-cost''', '''fan-less''' single board computer that unleashes '''laptop-like performance''' and '''expandability''' without the bulk, expense, or noise of typical desktop machines.<br>
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IGEP0020 is based on '''OMAP35xx''' and '''DM37xx'''
  
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== [[Image:Igep0020.jpg|center|460x308px|IGEPv2 board Revision C]]Platform Features  ==
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[[Image:Igep0020.jpg|460x308px|IGEPv2 board Revision C]]
  
 
*[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] pin compatible family multicore processor.  
 
*[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] pin compatible family multicore processor.  
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*[[TPS65950|Keypad connector.]]<br>  
 
*[[TPS65950|Keypad connector.]]<br>  
 
*RTC Battery backup.<br>  
 
*RTC Battery backup.<br>  
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*JTAG&nbsp;Expansion Connector.  
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*JTAG Expansion Connector.  
 
*Wall plug 5 VDC/1A or JST input.  
 
*Wall plug 5 VDC/1A or JST input.  
 
*3 UARTS Available.  
 
*3 UARTS Available.  
 
*1 [[Using serial debug port to communicate|Serial Debug Console Port]].  
 
*1 [[Using serial debug port to communicate|Serial Debug Console Port]].  
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*2 ADC&nbsp;: 1 and 3 MSP/s.  
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*2 ADC: 1 and 3 MSP/s.  
 
*Temperature Range: -40 to +80º C (See availablitity models).  
 
*Temperature Range: -40 to +80º C (See availablitity models).  
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*&nbsp;EMI and EMC precertificate. CE compliant.<br>  
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*EMI and EMC precertificate. CE compliant.<br>  
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*[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2/HW_Mechanical Small form factor].
 
  
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<br>  
  
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== IGEPv2 Board Features ==
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== IGEPv2 Board Features by Revision ==
  
 
=== Revision A<br>  ===
 
=== Revision A<br>  ===
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*Released on November 2008.
 
*Released on November 2008.
  
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<br>
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<br>  
  
 
=== Revision B  ===
 
=== Revision B  ===
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*Released on May 2009.
 
*Released on May 2009.
  
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<br>
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<br>  
  
 
=== Revision C<br>  ===
 
=== Revision C<br>  ===
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*Released on March 2010.
 
*Released on March 2010.
  
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<br>
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<br>  
  
 
=== Revision C - OMAP35xx &amp; DM37xx Compatible<br>  ===
 
=== Revision C - OMAP35xx &amp; DM37xx Compatible<br>  ===
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== IGEPv2 Board Audio  ==
 
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=== General settings  ===
 
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The TPS65950 provides 2 gain stages which can be used to change the audio out signal amplitude. A digital gain which can be regulated by two alsa mixer settings and a analog one. Following code snippets may help you to use it.
 
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amixer set -D hw:0 'DAC2 Analog' 50%
 
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amixer set -D hw:0 'DAC2 Digital Fine' 50%
 
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amixer set -D hw:0 'DAC2 Digital Coarse' 50%
 
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=== Headset Output  ===
 
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Hardware access via
 
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3.5mm standard stereo audio jack mounted on the top of the board
 
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In order to activate headset output, following commands have to be executed on shell.
 
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amixer set -D hw:0 'Headset' 0dB
 
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amixer set -D hw:0 'HeadsetL Mixer AudioL2' on
 
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amixer set -D hw:0 'HeadsetR Mixer AudioR2' on
 
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=== Earphone Output  ===
 
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Hardware access via
 
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TP606 = EAR.P
 
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TP605 = EAR.M
 
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which are on the backside of the board
 
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In order to activate earphone output, following commands have to be executed on shell.
 
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amixer set -D hw:0 'Earpiece' 6dB
 
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amixer set -D hw:0 'Earpiece Mixer AudioL2' on
 
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amixer set -D hw:0 'Earpiece Mixer AudioR2' on
 
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<br>
 
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= IGEPv2 Industrial Applications  =
 
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== 24 Ghz Radar  ==
 
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*[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/RADAR 24 Ghz RADAR brochedure]
 
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*[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/RADAR 24 Ghz&nbsp;RADAR technical specification]
 
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*[http://labs.igep.es/index.php/Radar_v2 Radar v2 Board]
 
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<br>
 
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= Expansion Board  =
 
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The [http://igep.es/index.php?option=com_content&view=article&id=102&Itemid=115 IGEPv2 EXPANSION] board is a low-cost expansion board for IGEPv2 Board. It consists on a expansion board for IGEPv2 Board which you can attach to any IGEPv2 Board for testing even more features and interficies. This board is designed for those developers who want to test even more capabilities of the IGEP Devices.<br><br>
 
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[[Image:Igep0022.jpg|left|443x333px]]<br>
 
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[[Image:Igep0022 igep0020 combo.jpg|right|454x304px]]
 
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*Modem GSM/GPRS based on [http://www.telit.com/en/products/gsm-gprs.php?p_id=12&p_ac=show&p=47 TELIT GE865] module with SIMCARD connector and external cable Antenna.
 
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*LCD and touch interface for 7.0 inch [http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=%2Fvar%2Fwww%2Fvhosts%2Figep.es%2Fhttpdocs%2Fdownloads%2F01-ISEE_Products%2FACCESSORIES%2FLCD%2FSEIKO&download_file=%2Fvar%2Fwww%2Fvhosts%2Figep.es%2Fhttpdocs%2Fdownloads%2F01-ISEE_Products%2FACCESSORIES%2FLCD%2FSEIKO%2F70WVW1TZ3.pdf SEIKO LCD]: 3 connectors (40pin FFC for TFT interface + 4pin FFC for touch + 6pin FFC for LED backlight).
 
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*LCD and touch interface for 4.3 inch [http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=%2Fvar%2Fwww%2Fvhosts%2Figep.es%2Fhttpdocs%2Fdownloads%2F01-ISEE_Products%2FACCESSORIES%2FLCD%2FPOWERTIP&download_file=%2Fvar%2Fwww%2Fvhosts%2Figep.es%2Fhttpdocs%2Fdownloads%2F01-ISEE_Products%2FACCESSORIES%2FLCD%2FPOWERTIP%2FSPF-PH480272T-005-I11Q.pdf POWERTIP LCD]: 40pin FFC for TFT [[|]]interface, touch and LED backlight).
 
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*VGA interface on [http://en.wikipedia.org/wiki/VGA_connector D-SUB15] connector.
 
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*2 x video composite inputs on RCA connector. Video Decoder based on [http://focus.ti.com/docs/prod/folders/print/tvp5150.html TEXAS Video Decoder TVP5150].
 
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*Camera interface for e-con Systems e-CAM32_OMAP module.
 
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*CAN bus interface with 3 pin connector. CAN interface based on [http://www.google.com/url?sa=t&source=web&ct=res&cd=1&ved=0CC0QFjAA&url=http%3A%2F%2Fww1.microchip.com%2Fdownloads%2Fen%2FDeviceDoc%2F21801d.pdf&ei=E5H-S_a1MpSA4Qag0pnuDQ&usg=AFQjCNG0_hGd0ETah_EEFEO5iiOZoajxEg&sig2=St0dTRs-mKLmZVHEIZ9t7w MICROCHIP MCP2515 CAN] controller.
 
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*LVDS video serializer ([http://www.maxim-ic.com/quick_view2.cfm/qv_pk/3443 MAX9247]).
 
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*[http://en.wikipedia.org/wiki/RS-232 RS232 - Serial port on DB9 connector].
 
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*Size: idem IGEPv2.
 
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<br>IGEPv2 Expansion board and LCD displays (7.0' and 4.3') will be available on online store in different configurations:
 
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*IGEPv2 Exp. Board - Network: Modem GSM/GPRS + CAN interface + DB9 connector
 
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*IGEPv2 Exp. Board - Multimedia: VGA + LCD interface + Video Inputs + Camera interface
 
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*IGEPv2 Exp. Board - Full: all interfaces.
 
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[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2_EXP_BOARD Expansion Board schematics], mechanical drawing and bill of materials will be public.
 
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= See also  =
 
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*[[Getting Started with IGEP0020 board|Getting Started with IGEP0020 board]]
 
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*[[Getting Started with IGEP0022 board|Getting Started with IGEP0022 board]]
 
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[[Category:IGEP0020]]
 
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[[Category:Features]]
 

Revision as of 16:57, 28 July 2011

IGEPv2 Board Features

IGEP0020 is based on OMAP35xx and DM37xx

IGEPv2 board Revision C

  • TI OMAP35x pin compatible family multicore processor.
  • Processors Available OMAP3503, OMAP3515, OMAP3525, OMAP3530.
  • ARM CORTEX A8 core up to 720 Mhz.
  • DSP TMS320C64x+ core up to 520 Mhz.
  • POWERVR SGX 530 core up to 110 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)
  • IVA2.2 (Video Hardware Accelerators)
  • TPS65950 Power Management
  • DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
  • Linux BSP available (Board Support Package) and Windows CE (Under Development).
  • Ethernet 10/100 Mb BaseT - with EEPROM as option.
  • Wifi IEEE 802.11b/g + Bluetooth 2.0 (Integrated antenna).
  • Compatibility with a huge collection of USB peripherals including hubs, keyboards, mice, web cameras, and much more.
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with access LCD lines.
  • Expansion connector with access ISP lines.
  • Keypad connector.
  • RTC Battery backup.
  • JTAG Expansion Connector.
  • Wall plug 5 VDC/1A or JST input.
  • 3 UARTS Available.
  • 1 Serial Debug Console Port.
  • 2 ADC: 1 and 3 MSP/s.
  • Temperature Range: -40 to +80º C (See availablitity models).
  • EMI and EMC precertificate. CE compliant.


IGEPv2 Board Features by Revision

Revision A

  • TI OMAP3530: ARM CORTEX A8 core (500 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (330Mhz)
  • TPS65950 power managment
  • 2Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 166 Mhz (Package on Package - PoP technology)
  • Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • 1 x USB OTG
  • 1 x USB 2.0 Host
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT + SPI for touch control.
  • Keypad connector.
  • 2 ADC 1 and 3 MSP.
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
  • RS-485 Transceiver.
  • RS-232 Transceiver - Serial Debug Console.
  • Temperature Range: -40 to +80º C.
  • EMI and EMC certificate. CE compliant.
  • Expansion Board:
  1. TFT 7" Hitachi (TX18D35VM0APA) + Touch Screen + backlight.
  2. GSM/GPRS Telit GE864 - QUAD BAND
  3. ST - GPS (Information Under NDA)
  4. Battery ION-Li powered (charger, battery management)
  • Only available for medium/high volume customers.
  • Released on November 2008.


Revision B

  • TI OMAP3530: ARM CORTEX A8 core (600/720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (330/520Mhz)
  • TPS65950 power managment
  • 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
  • Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • 1 x USB OTG
  • 1 x USB 2.0 Host
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT + SPI for touch control.
  • Keypad connector.
  • 2 ADC 1 and 3 MSP [Optional].
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
  • RS-485 Transceiver.
  • RS-232 Transceiver - Serial Debug Console.
  • Temperature Range: -40 to +80º C.
  • EMI and EMC pre-certificate. CE compliant.
  • Hardware Reference Manual revision 1.13.
  • Mechanical Dimensions.
  • Released on May 2009.


Revision C

  • TI OMAP3530: ARM CORTEX A8 core (720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
  • TI DM3730: ARM CORTEX A8 core (from 800MHz to 1Ghz) + + POWERVR SGX 530 core (200Mhz) + IVA2.2 + DSP TMS320C64x+ (800Mhz)
  • TPS65950 power managment.
  • 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
  • Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • 1 x USB OTG
  • 1 x USB 2.0 Host
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT + SPI for touch control.
  • Keypad connector.
  • Expansion connector with ISP.
  • 2 ADC 1 and 3 MSP [Optional].
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
  • RS-485 Transceiver / RS-232 Transceiver.
  • RS-232 Transceiver - Serial Debug Console.
  • RTC Battery backup.
  • Temperature Range: -40 to +80º C.
  • EMI and EMC pre-certificate. CE compliant.
  • Hardware Reference Manual revision 1.15.
  • Mechanical Dimensions.
  • Released on March 2010.


Revision C - OMAP35xx & DM37xx Compatible

  • Compatible with OMAP35xx and DM37xx processor families.
  • TI OMAP3530: ARM CORTEX A8 core (720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
  • TI DM3730: ARM CORTEX A8 core (from 800MHz to 1Ghz) + + POWERVR SGX 530 core (200Mhz) + IVA2.2 + DSP TMS320C64x+ (800Mhz)
  • TPS65950 power managment.
  • 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
  • Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • 1 x USB OTG
  • 1 x USB 2.0 Host
  • MicroSD connector.
  • DVI-D for connecting digital computer monitors.
  • Stereo audio in and out for a microphone and headphones or speakers.
  • Expansion connector with I/O, SPI, UART...
  • Expansion connector with TFT + SPI for touch control.
  • Keypad connector.
  • Expansion connector with ISP.
  • 2 ADC 1 and 3 MSP [Optional].
  • Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
  • RS-485 Transceiver / RS-232 Transceiver.
  • RS-232 Transceiver - Serial Debug Console.
  • RTC Battery backup.
  • Temperature Range: -40 to +80º C.
  • EMI and EMC pre-certificate. CE compliant.
  • Hardware Reference Manual revision 1.15.
  • Mechanical Dimensions.
  • Released on October 2010.


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