Difference between revisions of "IGEP0020 Features"
From IGEP - ISEE Wiki
Manel Caro (talk | contribs) (Added Revision D) |
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*[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2/HW_Mechanical Mechanical Dimensions]. | *[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2/HW_Mechanical Mechanical Dimensions]. | ||
*Released on March 2010. | *Released on March 2010. | ||
+ | |||
+ | <br> | ||
+ | |||
+ | === Revision D<br> === | ||
+ | |||
+ | *Compatible with OMAP35xx and DM37xx processor families. | ||
+ | *TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core ('''720Mhz''') + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ ('''520Mhz''') | ||
+ | *TI DM3730: ARM CORTEX A8 core ('''1Ghz''') + + POWERVR SGX 530 core ('''200Mhz''') + IVA2.2 + DSP TMS320C64x+ ('''800Mhz''') <br> | ||
+ | *[[TPS65950|TPS65950]] power managment. | ||
+ | *4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology) | ||
+ | *Ethernet 10/100 Mb BaseT ([http://www.smsc.com/ SMSC] [http://www.smsc.com/index.php?tid=145&pid=116 LAN9221i]) with MAC EEPROM [optional] | ||
+ | *[http://en.wikipedia.org/wiki/IEEE_802.11 Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA) | ||
+ | *[http://en.wikipedia.org/wiki/Bluetooth Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e) | ||
+ | *Integrated antenna and connector for external antenna. | ||
+ | *1 x [http://en.wikipedia.org/wiki/USB_OTG USB OTG] | ||
+ | *1 x [http://en.wikipedia.org/wiki/USB USB ]2.0 Host<br> | ||
+ | *MicroSD connector. | ||
+ | *[http://en.wikipedia.org/wiki/DVI-D DVI-D] for connecting digital computer monitors. | ||
+ | *Stereo audio in and out for a microphone and headphones or speakers. | ||
+ | *Expansion connector with I/O, SPI, UART... | ||
+ | *Expansion connector with TFT + SPI for touch control.<br> | ||
+ | *[[TPS65950#Subsystems|Keypad connector]].<br> | ||
+ | *Expansion connector with ISP.<br> | ||
+ | *2 ADC 1 and 3 MSP [Optional]. | ||
+ | *Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector). | ||
+ | *RS-485 Transceiver / RS-232 Transceiver. | ||
+ | *RS-232 Transceiver - [[Serial Debug Console|Serial Debug Console]]. | ||
+ | *RTC Battery backup.<br> | ||
+ | *Temperature Range: -40 to +80º C. | ||
+ | *EMI and EMC pre-certificate. CE compliant.<br> | ||
+ | *[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2/HW_User_Manuals Hardware Reference Manual revision 1.15]. | ||
+ | *[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2/HW_Mechanical Mechanical Dimensions]. | ||
+ | *It will be Released on September 2010. | ||
+ | |||
+ | <br> | ||
= IGEPv2 Industrial Applications = | = IGEPv2 Industrial Applications = | ||
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[http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2_EXP_BOARD Expansion Board schematics], mechanical drawing and bill of materials will be public. | [http://www.igep.es/index.php?option=com_content&view=article&id=99&Itemid=112&dir=/var/www/vhosts/igep.es/httpdocs/downloads/01-ISEE_Products/IGEPv2_EXP_BOARD Expansion Board schematics], mechanical drawing and bill of materials will be public. | ||
− | |||
[[Category:Hardware]] | [[Category:Hardware]] |
Revision as of 14:43, 8 September 2010
Contents
IGEPv2 Board
IGEPv2 BOARD is a low-cost, fan-less single board computer that unleashes laptop-like performance and expandability without the bulk, expense, or noise of typical desktop machines.
Platform Features
- TI OMAP35x pin compatible family multicore processor.
- Processors Available OMAP3503, OMAP3515, OMAP3525, OMAP3530.
- ARM CORTEX A8 core up to 720 Mhz.
- DSP TMS320C64x+ core up to 520 Mhz.
- POWERVR SGX 530 core up to 110 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)
- IVA2.2 (Video Hardware Accelerators)
- TPS65950 Power Management
- DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
- Linux BSP available (Board Support Package) and Windows CE (Under Development).
- Ethernet 10/100 Mb BaseT - with EEPROM as option.
- Wifi IEEE 802.11b/g + Bluetooth 2.0 (Integrated antenna).
- Compatibility with a huge collection of USB peripherals including hubs, keyboards, mice, web cameras, and much more.
- MicroSD connector.
- DVI-D for connecting digital computer monitors.
- Stereo audio in and out for a microphone and headphones or speakers.
- Expansion connector with I/O, SPI, UART...
- Expansion connector with access LCD lines.
- Expansion connector with access ISP lines.
- Keypad connector.
- RTC Battery backup.
- JTAG Expansion Connector.
- Wall plug 5 VDC/1A or JST input.
- 3 UARTS Available.
- 1 Serial Debug Console Port.
- 2 ADC : 1 and 3 MSP/s.
- Temperature Range: -40 to +80º C (See availablitity models).
- EMI and EMC precertificate. CE compliant.
- Small form factor.
IGEPv2 BOARD Features
Revision A
- TI OMAP3530: ARM CORTEX A8 core (500 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (330Mhz)
- TPS65950 power managment
- 2Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 166 Mhz (Package on Package - PoP technology)
- Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM
- Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
- Bluetooth 2.0 (CSR BC4ROM/21e)
- Integrated antenna and connector for external antenna.
- 1 x USB OTG
- 1 x USB 2.0 Host
- MicroSD connector.
- DVI-D for connecting digital computer monitors.
- Stereo audio in and out for a microphone and headphones or speakers.
- Expansion connector with I/O, SPI, UART...
- Expansion connector with TFT + SPI for touch control.
- Keypad connector.
- 2 ADC 1 and 3 MSP.
- Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
- RS-485 Transceiver.
- RS-232 Transceiver - Serial Debug Console.
- Temperature Range: -40 to +80º C.
- EMI and EMC certificate. CE compliant.
- Expansion Board:
- TFT 7" Hitachi (TX18D35VM0APA) + Touch Screen + backlight.
- GSM/GPRS Telit GE864 - QUAD BAND
- ST - GPS (Information Under NDA)
- Battery ION-Li powered (charger, battery management)
- Only available for medium/high volume customers.
- Released on November 2008.
Revision B
- TI OMAP3530: ARM CORTEX A8 core (600/720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (330/520Mhz)
- TPS65950 power managment
- 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
- Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
- Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
- Bluetooth 2.0 (CSR BC4ROM/21e)
- Integrated antenna and connector for external antenna.
- 1 x USB OTG
- 1 x USB 2.0 Host
- MicroSD connector.
- DVI-D for connecting digital computer monitors.
- Stereo audio in and out for a microphone and headphones or speakers.
- Expansion connector with I/O, SPI, UART...
- Expansion connector with TFT + SPI for touch control.
- Keypad connector.
- 2 ADC 1 and 3 MSP [Optional].
- Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
- RS-485 Transceiver.
- RS-232 Transceiver - Serial Debug Console.
- Temperature Range: -40 to +80º C.
- EMI and EMC pre-certificate. CE compliant.
- Hardware Reference Manual revision 1.13.
- Mechanical Dimensions.
- Released on May 2009.
Revision C
- TI OMAP3530: ARM CORTEX A8 core (720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
- TPS65950 power managment.
- 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
- Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
- Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
- Bluetooth 2.0 (CSR BC4ROM/21e)
- Integrated antenna and connector for external antenna.
- 1 x USB OTG
- 1 x USB 2.0 Host
- MicroSD connector.
- DVI-D for connecting digital computer monitors.
- Stereo audio in and out for a microphone and headphones or speakers.
- Expansion connector with I/O, SPI, UART...
- Expansion connector with TFT + SPI for touch control.
- Keypad connector.
- Expansion connector with ISP.
- 2 ADC 1 and 3 MSP [Optional].
- Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
- RS-485 Transceiver / RS-232 Transceiver.
- RS-232 Transceiver - Serial Debug Console.
- RTC Battery backup.
- Temperature Range: -40 to +80º C.
- EMI and EMC pre-certificate. CE compliant.
- Hardware Reference Manual revision 1.15.
- Mechanical Dimensions.
- Released on March 2010.
Revision D
- Compatible with OMAP35xx and DM37xx processor families.
- TI OMAP3530: ARM CORTEX A8 core (720Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
- TI DM3730: ARM CORTEX A8 core (1Ghz) + + POWERVR SGX 530 core (200Mhz) + IVA2.2 + DSP TMS320C64x+ (800Mhz)
- TPS65950 power managment.
- 4Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200Mhz (Package on Package - PoP technology)
- Ethernet 10/100 Mb BaseT (SMSC LAN9221i) with MAC EEPROM [optional]
- Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
- Bluetooth 2.0 (CSR BC4ROM/21e)
- Integrated antenna and connector for external antenna.
- 1 x USB OTG
- 1 x USB 2.0 Host
- MicroSD connector.
- DVI-D for connecting digital computer monitors.
- Stereo audio in and out for a microphone and headphones or speakers.
- Expansion connector with I/O, SPI, UART...
- Expansion connector with TFT + SPI for touch control.
- Keypad connector.
- Expansion connector with ISP.
- 2 ADC 1 and 3 MSP [Optional].
- Wall plug 5 Vdc / 1A or JST input (5V and RS485 Connector).
- RS-485 Transceiver / RS-232 Transceiver.
- RS-232 Transceiver - Serial Debug Console.
- RTC Battery backup.
- Temperature Range: -40 to +80º C.
- EMI and EMC pre-certificate. CE compliant.
- Hardware Reference Manual revision 1.15.
- Mechanical Dimensions.
- It will be Released on September 2010.
IGEPv2 Industrial Applications
24 Ghz Radar
Expansion Board
- Modem GSM/GPRS based on TELIT GE865 module with SIMCARD connector and external cable Antenna.
- LCD and touch interface for 7.0 inch SEIKO LCD: 3 connectors (40pin FFC for TFT interface + 4pin FFC for touch + 6pin FFC for LED backlight).
- LCD and touch interface for 4.3 inch POWERTIP LCD: 40pin FFC for TFT interface, touch and LED backlight).
- VGA interface on D-SUB15 connector.
- 2 x video composite inputs on RCA connector. Video Decoder based on TEXAS Video Decoder TVP5150.
- Camera interface for e-con Systems e-CAM32_OMAP module.
- CAN bus interface with 3 pin connector. CAN interface based on MICROCHIP MCP2515 CAN controller.
- LVDS video serializer (MAX9247).
- RS232 - Serial port on DB9 connector.
- Size: idem IGEPv2.
IGEPv2 Expansion board and LCD displays (7.0' and 4.3') will be available on online store in different configurations:
- IGEPv2 Exp. Board - Network: Modem GSM/GPRS + CAN interface + DB9 connector
- IGEPv2 Exp. Board - Multimedia: VGA + LCD interface + Video Inputs + Camera interface
- IGEPv2 Exp. Board - Full: all interfaces.
Expansion Board schematics, mechanical drawing and bill of materials will be public.