Difference between revisions of "IMX6 Dual"
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'''<u>CPU Complex</u>''' | '''<u>CPU Complex</u>''' | ||
− | + | * 2x [http://www.arm.com/ ARM] [https://developer.arm.com/products/processors/cortex-a/cortex-a9 Cortex-A9] up to 1.2 GHz | |
− | + | * [https://developer.arm.com/technologies/neon NEON SIMD media accelerator] | |
<u>'''Memory'''</u> | <u>'''Memory'''</u> | ||
− | <div id="panel3" class="panel-collapse collapse in" role="tabpanel" aria-labelledby="headingOne" aria-expanded="true"> | + | <div id="panel3" class="panel-collapse collapse in" role="tabpanel" aria-labelledby="headingOne" aria-expanded="true"> |
− | * 2x32 LP-DDR2, 1x64 DDR3 / LV-DDR3 | + | * DDR |
− | + | ** 2x32 LP-DDR2, 1x64 DDR3 / LV-DDR3 | |
− | NAND | + | * NAND |
− | + | ** SLC/MLC, 40-bit ECC, ONFI2.2, DDR | |
− | * SLC/MLC, 40-bit ECC, ONFI2.2, DDR | ||
<u>'''Connectivity'''</u> | <u>'''Connectivity'''</u> | ||
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* S-ATA and PHY | * S-ATA and PHY | ||
− | |||
</div> | </div> | ||
<u>'''Advanced power management'''</u> | <u>'''Advanced power management'''</u> | ||
− | <div id="panel6" class="panel-collapse collapse in" role="tabpanel" aria-labelledby="headingOne"> | + | <div id="panel6" class="panel-collapse collapse in" role="tabpanel" aria-labelledby="headingOne"> |
− | [https://www.nxp.com/products/power-management/pmics/configurable-pmics-pf-series/14-channel-configurable-power-management-ic:MMPF0100 NXP PF100 power management unit] | + | * PMU integration |
+ | * [https://www.nxp.com/products/power-management/pmics/configurable-pmics-pf-series/14-channel-configurable-power-management-ic:MMPF0100 NXP PF100 power management unit] | ||
+ | <u>'''Package and temperature'''</u> | ||
+ | |||
+ | <div id="panel8" class="panel-collapse collapse in" role="tabpanel" aria-labelledby="headingOne" aria-expanded="true"><div class="toggle_container"> | ||
+ | * 21 x 21mm, 0.8 mm BGA | ||
+ | * Consumer (-20C to +105C), up to 1.2 GHz | ||
+ | * Industrial (-40C to +105C), up to 800 MHz | ||
+ | * Automotive (-40C to +125C), AEC-Q100, up to 1 GHz | ||
+ | |||
+ | </div> | ||
+ | </div> | ||
</div> | </div> | ||
==Block diagram== | ==Block diagram== | ||
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* [https://www.nxp.com/docs/en/fact-sheet/IMX6SRSFS.pdf i.MX 6 Series of Applications Processors Fact Sheet] | * [https://www.nxp.com/docs/en/fact-sheet/IMX6SRSFS.pdf i.MX 6 Series of Applications Processors Fact Sheet] | ||
* [https://www.nxp.com/docs/en/reference-manual/IMX6DQRM.pdf i.MX 6Dual/6Quad Applications Processor Reference Manual] | * [https://www.nxp.com/docs/en/reference-manual/IMX6DQRM.pdf i.MX 6Dual/6Quad Applications Processor Reference Manual] | ||
− | |||
==See also== | ==See also== |
Latest revision as of 12:01, 4 April 2018
NXP i.MX6 Dual
CPU Complex
- 2x ARM Cortex-A9 up to 1.2 GHz
- NEON SIMD media accelerator
Memory
- DDR
- 2x32 LP-DDR2, 1x64 DDR3 / LV-DDR3
- NAND
- SLC/MLC, 40-bit ECC, ONFI2.2, DDR
Connectivity
- S-ATA and PHY
Advanced power management
- PMU integration
- NXP PF100 power management unit
Package and temperature
- 21 x 21mm, 0.8 mm BGA
- Consumer (-20C to +105C), up to 1.2 GHz
- Industrial (-40C to +105C), up to 800 MHz
- Automotive (-40C to +125C), AEC-Q100, up to 1 GHz
Block diagram
Documentation
- i.MX 6Dual/6Quad Applications Processors for Consumer Products - Data Sheet
- i.MX 6Dual/6Quad Automotive and Infotainment Applications Processors - Data Sheet
- i.MX 6Dual/6Quad Consumer-PoP Applications Processor Data Sheet
- i.MX 6Dual/6Quad Applications Processors for Industrial Products - Data Sheet
- IMX6DQ6SDLHDG, Hardware Development Guide for i.MX 6Quad, 6Dual, 6DualLite, 6Solo Families of Applications Processors
- i.MX 6 Series of Applications Processors Fact Sheet
- i.MX 6Dual/6Quad Applications Processor Reference Manual