IGEP0030 Features
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IGEP module
IGEP MODULE is a computer on module designed by ISEE for industrial and commercial market. It's low cost, high performance and production ready module.
IGEP MODULE can be used as a computer-on-module for your product but also as a stand alone computer without the need of a baseboard based on TI OMAP Application Processor with ARM Cortex-A8 MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.
You don't need anything else than a USB cable to power the IGEP MODULE and communicate with it by using USB OTG interface or wifi/bluetooth interface.
This single mini-board integrates all the capabilities of the IGEPv2 Board but with just a few of them implemented. This product is designed for those developers who already tested all the IGEP Platform possibilites on IGEPv2 Board and they want to design their own product.
That means you can use all the IGEP possibilities and create your own expansion board with the specific peripherals of your design. Otherwise, you can contact with the ISEE team (Integration Software Electronic Engineering) where you can ask for a customized board design with your own peripherals, specifications, etc.
Platform Description
- TI OMAP35x and TI DM37x pin compatible family multicore processor.
- Processors Available: OMAP3503 (600Mhz), OMAP3530 (600 or 720 Mhz), DM3703 (800 Mhz or 1 Ghz), DM3730 (800Mhz or 1 Ghz).
- ARM Cortex-A8 core up to 1 Ghz.
- DSP TMS320C64x+ core up to 800 Mhz.
- Imagination Technologies POWERVR SGX 530 core up to 200 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)
- IVA2.2 (Video Hardware Accelerators).
- TPS65950 Power Management.
- DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
- Available Memory densities:
- 128MByte LPDDR RAM and 256MByte OneNAND flash
- 512MByte LPDDR RAM and 512MByte OneNAND flash
- GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010).
- WIFI IEEE 802.11b/g (Marvell 88w8686) + Bluetooth 2.0 (CSR Bluecore) with external or Integrated antenna.
- On board microSD Slot.
- On board USB 2.0 OTG miniAB socket for power and data.
- On board USB 2.0 Host interface.
- I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
- Keyboard.
- Headset, Microphone, backup battery.
- USB OTG signals, USB HS Host.
- 2 x 70-pin PCB to PCB connector.
- 2 x 27-pin flex ribbon connector.
- Module Size: 18 x 68 mm.
IGEP Module Features
Revision A
- TI OMAP3503: ARM CORTEX A8 core (600 Mhz)
- TPS65950 power managment
- 1 Gb NAND/ 2 Gb Mobile Low Power DDR SDRAM @ 166 Mhz (Package on Package - PoP technology)
- [OPTIONAL Wifi IEEE 802.11b/g] (Marvell 86w8686B1 information under NDA).
- [OPTIONAL Bluetooth] 2.0 (CSR BC4ROM/21e).
- Integrated antenna and connector for external antenna.
- On board USB 2.0 OTG miniAB socket for power and data.
- I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
- Keyboard.
- Headset, Microphone, backup battery.
- USB OTG signals, USB HS Host.
- 2 x 70-pin PCB to PCB connector.
- 2 x 27-pin flex ribbon connector.
- Module Size: 18 x 68 mm.
- Temperature Range: -40 to +85º C.
- EMI and EMC certificate. CE compliant.
- Only available for medium/high volume orders.
Availability
2Q - 2010.
Revision D
- TI OMAP3530: ARM CORTEX A8 core (720 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
- TPS65950 power managment
- 4 Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200 Mhz (Package on Package - PoP technology)
- Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
- Bluetooth 2.0 (CSR BC4ROM/21e)
- Connector for external antenna.
- On board USB 2.0 OTG miniAB socket for power and data.
- I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
- Keyboard.
- Headset, Microphone, backup battery.
- USB OTG signals, USB HS Host.
- 2 x 70-pin PCB to PCB connector.
- 2 x 27-pin flex ribbon connector.
- Module Size: 18 x 68 mm.
- Temperature Range: -40 to +85º C. (Optional)
- EMI and EMC certificate. CE compliant.
- Max. Video Resolution 1080P, 720P.
- Video encoding & decoding up to D1 resolution.
Availability
3Q - 2010.
Revision E
- TI OMAP - DM3730: ARM CORTEX A8 core (1Ghz) + POWERVR SGX 530 core (200 Mhz) + IVA2.2 + DSP TMS320C64x+ (800Mhz)
- TPS65950 power managment
- 4 Gbit NAND/ 4Gbit Mobile Low Power DDR SDRAM @ 200 Mhz (Package on Package - PoP technology)
- Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
- Bluetooth 2.0 (CSR BC4ROM/21e)
- Integrated antenna and connector for external antenna.
- On board USB 2.0 OTG miniAB socket for power and data.
- I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
- Keyboard.
- Headset, Microphone, backup battery.
- USB OTG signals, USB HS Host.
- 2 x 70-pin PCB to PCB connector.
- 2 x 27-pin flex ribbon connector.
- Module Size: 18 x 68 mm.
- Temperature Range: -40 to +85º C.
- EMI and EMC certificate. CE compliant.
- Max. Video Resolution (DSS) 1080P, 720P.
- Video encoding & decoding up to 720P resolution.
Availability
1Q - 2011.
IGEP Module Base board
The base board will be the perfect complement for rapid development in custom designs and it offers a variety of peripherals.
Revision A
- 2 Ethernet Memory Mapped controllers based on SMSC 9221i - 10/100 BaseT.
- DVI-D on HDMI connector.
- 2 - LAN9221 Industrial Ethernet 10/100 Mb BaseT.
- 1 - USB Host on USB-A connector
- 1 - Input Stereo Audio Line Jack.
- 1 - Output Stereo Audio Line Jack.
- 1 - DB9 (RS232 UART3 - DEBUG Console)
- 2 - RED leds.
- 1 - Power jack 5VDC Input.
- 1 - User button
- Board Size: 195 x 132 mm.
Availability
1Q - 2011.
