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Small module SINGLE core ARM Cortex-A8 up to 1000 MHz

Com Module W 03.jpg

The IGEP COM MODULE is an industrial processor board. It can be used as a computer-on-module for your product. The IGEP COM MODULE provides a lot of features in a small size. You can build your project anywhere you want.



DM3730 / AM3703, by Texas Instruments
ARM Cortex-A8
NEON SIMD Coprocessor
Frequency speed 1000 MHz
TMS320C64+ DSP 800 MHz (Only in DM3730 version)

3D/2D Accelerator PowerVR SGX GPU, providing graphics acceleration with OpenGL ES1.0, OpenGL ES2.0 and OpenVG support (Only in DM3730 version)

Video acceleration: H.264, H.263, MPEG-4, MPEG-2, JPEG, WMV9 and additional codecs. Video encoder/decoder up to 720p (Only in DM3730 version)

Memory RAM: Up to 512 MB Mobile DDR (Standard setup 512 MB)
Flash: Up to 512 MB (Standard setup 512 MB)
Onboard micro-SD card socket



1 x USB 2.0 Host (connector not included)
1 x USB 2.0 OTG


1 x Digital Video/TFT interface
Resolution 2048 x 2048 – 24 bits
1 x Analog S-Video interface (Optional)

Image Capture Interface 1 x CPI interface (12 bits)

WiFi IEEE 802.11 b/g/n (Access Point: Yes)
Bluetooth v4.0 (BLE)


1 x Internal WiFi/Bluetooth antenna
1 x U.FL connector for external antenna

Additional Interfaces

(Other combinations available, see Hardware Manual for more information)

4 x UART
1 x I2C
1 x MMC (No WiFi version)
1 x I2S
1 x GPMC
1 x Analog Audio In
1 x Audio Out
2 x SPI
76 x GPIO (Maximum number of GPIOs)
5 x Analog-to-Digital Converter
4 x PWM

SW Support Linux
Power Supply Power from expansion connectors: From 3,5 V to 4,2 V
Digital I/O voltage: 1,8 V
Power Consumption Typical 1 W (depending on software)
Maximum 2 W (depending on software)
Thermal Commercial temperature: 0 ºC to +60 ºC
Industrial temperature: -40 ºC to +85 ºC
Form Factor 18 mm x 68.5 mm
Gumstix compatible
Humidity 93% relative Humidity at 40 ºC, non-condensing (according to IEC 60068-2-78)
MTBF > 100000 hours


  • DM3730, by Texas Instruments
  • AM3703, by Texas Instruments
    ARM Cortex-A8
    Frequency speed 1000 MHz
  • Commercial temperature: 0 ºC to +60 ºC
  • Industrial temperature: -40 ºC to +85 ºC
Main Memory
  • 256 MB Mobile DDR
  • 512 MB Mobile DDR
Flash Memory
  • No flash
  • 256 MB
  • 512 MB
  • No WiFi/Bluetooth
  • WiFi IEEE 802.11 b/g/n (Access Point: Yes)
    Bluetooth v4.0 (BLE)
3D/2D Accelerator - Video
  • Only DM3730



  1. IGEP COM MODULE Boot Pin-out
  2. How to prepare a ready to boot firmware
  3. U-Boot Bootloader
  4. Linux Kernel
  5. IGEP Firmware set-up
  6. Boot from MicroSD Card
  7. Boot from NAND/eMMC flash.
  8. Update Installed IGEP Firmware



Custom Software


Getting started with IGEP COM MODULE

Ubuntu / Debian