Difference between revisions of "IGEP0040TestsProtosRA"
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m (Replaced content with 'Back to IGEP0040 main project page == VALIDATION OF PROTOTYPES == TBD == ISSUES AND IMPROVEMENTS == === IGEP0040-RA01 version - Hynix memory === TBD === IGEP0040-R…') |
m (→IGEP0040-RA03 version - Micron memory) |
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=== IGEP0040-RA03 version - Micron memory === | === IGEP0040-RA03 version - Micron memory === | ||
| − | + | Firsts test applied to 1 hand labeled board: | |
| + | * Visual mount inspection --> OK | ||
| + | * Check main sources: 5V; 1V8 (WIFI clean); VDDQ; VTT; 1V2; 2V; 1V8 (V_1P8); 3V3 (V_3P3); VCC_MAIN --> OK | ||
| + | * Overall consumption: 5V@0.21A ---> OK | ||
| + | * Removed Standalone Marvell debug flex connector ---> Broken some NC pads from footprint (OK) | ||
=== RA0x common === | === RA0x common === | ||
Revision as of 17:50, 6 August 2015
Back to IGEP0040 main project page
Contents
VALIDATION OF PROTOTYPES
TBD
ISSUES AND IMPROVEMENTS
IGEP0040-RA01 version - Hynix memory
TBD
IGEP0040-RA02 version - Samsung memory
IGEP0040-RA03 version - Micron memory
Firsts test applied to 1 hand labeled board:
- Visual mount inspection --> OK
- Check main sources: 5V; 1V8 (WIFI clean); VDDQ; VTT; 1V2; 2V; 1V8 (V_1P8); 3V3 (V_3P3); VCC_MAIN --> OK
- Overall consumption: 5V@0.21A ---> OK
- Removed Standalone Marvell debug flex connector ---> Broken some NC pads from footprint (OK)
RA0x common
TBD
TESTS UTILS
JTAG
TBD
Serial debug
TBD
...
