Difference between revisions of "IGEP0030 Features"
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[[Image:IGEP module.jpg|center]]<br> | [[Image:IGEP module.jpg|center]]<br> | ||
| − | == | + | == Platform Description<br> == |
*[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] and [http://focus.ti.com/paramsearch/docs/parametricsearch.tsp?family=dsp§ionId=2&tabId=2668&familyId=1938¶mCriteria=no TI DM37x] pin compatible family multicore processor. | *[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] and [http://focus.ti.com/paramsearch/docs/parametricsearch.tsp?family=dsp§ionId=2&tabId=2668&familyId=1938¶mCriteria=no TI DM37x] pin compatible family multicore processor. | ||
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*[http://en.wikipedia.org/wiki/WiFi WIFI] IEEE 802.11b/g ([http://www.marvell.com/ Marvell ]88w8686) + Bluetooth 2.0 ([http://www.csr.com/home.php CSR ]Bluecore) with external or Integrated antenna. | *[http://en.wikipedia.org/wiki/WiFi WIFI] IEEE 802.11b/g ([http://www.marvell.com/ Marvell ]88w8686) + Bluetooth 2.0 ([http://www.csr.com/home.php CSR ]Bluecore) with external or Integrated antenna. | ||
*On board [http://en.wikipedia.org/wiki/MicroSD microSD] Slot.<br> | *On board [http://en.wikipedia.org/wiki/MicroSD microSD] Slot.<br> | ||
| − | *On board USB 2.0 OTG miniAB socket for power and data.<br> | + | *On board USB 2.0 OTG miniAB socket for power and data.<br> |
| − | *On board USB 2.0 Host interface.<br> | + | *On board USB 2.0 Host interface.<br> |
| − | *I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> | + | *I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> |
| − | *Keyboard. | + | *Keyboard. |
| − | *Headset, Microphone, backup battery.<br> | + | *Headset, Microphone, backup battery.<br> |
| − | *USB OTG signals, USB HS Host.<br> | + | *USB OTG signals, USB HS Host.<br> |
| − | *2 x 70-pin PCB to PCB connector.<br> | + | *2 x 70-pin PCB to PCB connector.<br> |
| − | *2 x 27-pin flex ribbon connector.<br> | + | *2 x 27-pin flex ribbon connector.<br> |
*Module Size: 18 x 68 mm.<br> | *Module Size: 18 x 68 mm.<br> | ||
| + | <br> | ||
| + | == IGEP Module Features<br> == | ||
| − | == IGEP Module Revision A == | + | === Revision A === |
| + | |||
| + | xxxxxxxxxxxxxxxxxxxx | ||
| + | |||
| + | |||
| + | |||
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| + | == IGEP Module Baseboard == | ||
| + | |||
| + | === Revision A === | ||
| + | |||
| + | xxxxxxxxxxxxxxxxxxxxxx | ||
Revision as of 00:35, 17 June 2010
Contents
IGEP module
IGEP MODULE is the new computer on module designed by ISEE for industrial and commercial market. It's low cost, high performance and production ready module.
IGEP MODULE can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on TI OMAP Application Processor with ARM Cortex-A8 MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.
You don't need anything else than a USB cable to power the IGEP MODULE and communicate with it by using USB OTG interface or wifi/bluetooth interface.
Platform Description
- TI OMAP35x and TI DM37x pin compatible family multicore processor.
- Processors Available OMAP3503, OMAP3515, OMAP3525, OMAP3530, DM3703, DM3715.
- ARM Cortex-A8 core up to 1 Ghz.
- DSP TMS320C64x+ core up to 800 Mhz.
- Imagination Technologies POWERVR SGX 530 core up to 200 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)
- IVA2.2 (Video Hardware Accelerators).
- TPS65950 Power Management.
- DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
- Available Memory densities:
- 128MByte LPDDR RAM and 256MByte OneNAND flash
- 256MByte LPDDR RAM and 512MByte OneNAND flash
- 512MByte LPDDR RAM and 512MByte OneNAND flash
- GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010).
- WIFI IEEE 802.11b/g (Marvell 88w8686) + Bluetooth 2.0 (CSR Bluecore) with external or Integrated antenna.
- On board microSD Slot.
- On board USB 2.0 OTG miniAB socket for power and data.
- On board USB 2.0 Host interface.
- I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
- Keyboard.
- Headset, Microphone, backup battery.
- USB OTG signals, USB HS Host.
- 2 x 70-pin PCB to PCB connector.
- 2 x 27-pin flex ribbon connector.
- Module Size: 18 x 68 mm.
IGEP Module Features
Revision A
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IGEP Module Baseboard
Revision A
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