Difference between revisions of "IGEP0030 Features"
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[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] is the new computer on module designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE] for industrial and commercial market. It's low cost, high performance and production ready module. | [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] is the new computer on module designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE] for industrial and commercial market. It's low cost, high performance and production ready module. | ||
| − | [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard. <br> | + | [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on [http://www.ti.com/ TI OMAP] Application Processor with [http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.<br> |
| − | You don't need anything else than a USB cable to power the [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] and communicate with it by using [http://en.wikipedia.org/wiki/USB_OTG USB OTG] interface or [http://en.wikipedia.org/wiki/Wi-Fi wifi]/[http://en.wikipedia.org/wiki/Bluetooth bluetooth] interface. | + | You don't need anything else than a USB cable to power the [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] and communicate with it by using [http://en.wikipedia.org/wiki/USB_OTG USB OTG] interface or [http://en.wikipedia.org/wiki/Wi-Fi wifi]/[http://en.wikipedia.org/wiki/Bluetooth bluetooth] interface. |
| + | <br> | ||
| − | + | [[Image:IGEP module.jpg|center]]<br> | |
| − | [[Image: | ||
== Module Features<br> == | == Module Features<br> == | ||
| − | *[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] pin compatible family multicore processor. | + | *[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] and [http://focus.ti.com/paramsearch/docs/parametricsearch.tsp?family=dsp§ionId=2&tabId=2668&familyId=1938¶mCriteria=no TI DM37x] pin compatible family multicore processor. |
| − | *Processors Available OMAP3503, OMAP3515, OMAP3525, [ | + | *Processors Available OMAP3503, OMAP3515, OMAP3525, [http://labs.igep.es/index.php/OMAP3530 OMAP3530], DM3703, DM3715.<br> |
*ARM CORTEX A8 core up to 1 Ghz.<br> | *ARM CORTEX A8 core up to 1 Ghz.<br> | ||
*DSP TMS320C64x+ core up to 800 Mhz.<br> | *DSP TMS320C64x+ core up to 800 Mhz.<br> | ||
| − | *POWERVR SGX 530 core up to 200 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG) | + | *[http://www.imgtec.com/powervr/sgx_series5.asp Imagination Technologies POWERVR SGX 530] core up to 200 Mhz ([http://www.khronos.org/opengles/2_X/ OpenGL® ES 2.0], [http://www.khronos.org/opengles/ OpenGL® ES 1.0] , [http://www.khronos.org/openvg/ OpenVG]) |
| − | *IVA2.2 (Video Hardware Accelerators) | + | *IVA2.2 (Video Hardware Accelerators). |
| − | *[[. | + | *[[TPS65950]] Power Management.<br> |
| − | + | *[http://en.wikipedia.org/wiki/DDR_SDRAM DDR RAM] plus [http://en.wikipedia.org/wiki/Flash_memory NAND Flash] Package on Package (PoP) memories (on OMAP chip). | |
| − | *Memory densities | + | *Available Memory densities:<br> |
| − | #128MByte RAM and 256MByte OneNAND flash<br> | + | #128MByte LPDDR RAM and 256MByte OneNAND flash<br> |
| − | #256MByte RAM and 512MByte OneNAND flash | + | #256MByte LPDDR RAM and 512MByte OneNAND flash<br> |
| − | #512MByte RAM and 512MByte OneNAND flash <br> | + | #512MByte LPDDR RAM and 512MByte OneNAND flash <br> |
| − | *Linux BSP available (Board Support Package) and Windows CE (Under Development, Available OCT/2010). | + | *GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010). |
| − | *WIFI IEEE 802.11b/g + Bluetooth 2.0 (Integrated antenna | + | *[http://en.wikipedia.org/wiki/WiFi WIFI] IEEE 802.11b/g ([http://www.marvell.com/ Marvell ]88w8686) + Bluetooth 2.0 ([http://www.csr.com/home.php CSR ]Bluecore) with external or Integrated antenna. |
| − | *<br> | + | *On board [http://en.wikipedia.org/wiki/MicroSD microSD] Slot.<br> |
| − | Processor: OMAP3503 and OMAP3530. Applications Processor with ARM Cortex-A8 CPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration | + | Processor: OMAP3503 and OMAP3530. Applications Processor with ARM Cortex-A8 CPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration |
| − | ** Memory: <br> o 128MByte RAM and 256MByte OneNAND flash<br> o 512MByte RAM and 512MByte OneNAND flash<br> * On board microSD slot<br> * On board USB 2.0 OTG miniAB socket for power and data<br> * On board USb 2.0 Host interface<br> * Features<br> o I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> o Headset, Microphone, backup battery<br> o USB OTG signals, USB HS Host<br> * Wireless<br> o Wifi 802.11 b/g<br> o Bluetooth 2.0<br> * Connections<br> o 2 x 70-pin PCB to PCB connector<br> o 2 x 27-pin flex ribbon connector<br> * Size: 18 x 68mm | + | **Memory: <br> o 128MByte RAM and 256MByte OneNAND flash<br> o 512MByte RAM and 512MByte OneNAND flash<br> * On board microSD slot<br> * On board USB 2.0 OTG miniAB socket for power and data<br> * On board USb 2.0 Host interface<br> * Features<br> o I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> o Headset, Microphone, backup battery<br> o USB OTG signals, USB HS Host<br> * Wireless<br> o Wifi 802.11 b/g<br> o Bluetooth 2.0<br> * Connections<br> o 2 x 70-pin PCB to PCB connector<br> o 2 x 27-pin flex ribbon connector<br> * Size: 18 x 68mm |
IGEP MODULE will be offered in various configurations: | IGEP MODULE will be offered in various configurations: | ||
Revision as of 00:24, 17 June 2010
IGEP module
IGEP MODULE is the new computer on module designed by ISEE for industrial and commercial market. It's low cost, high performance and production ready module.
IGEP MODULE can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on TI OMAP Application Processor with ARM Cortex-A8 MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.
You don't need anything else than a USB cable to power the IGEP MODULE and communicate with it by using USB OTG interface or wifi/bluetooth interface.
Module Features
- TI OMAP35x and TI DM37x pin compatible family multicore processor.
- Processors Available OMAP3503, OMAP3515, OMAP3525, OMAP3530, DM3703, DM3715.
- ARM CORTEX A8 core up to 1 Ghz.
- DSP TMS320C64x+ core up to 800 Mhz.
- Imagination Technologies POWERVR SGX 530 core up to 200 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)
- IVA2.2 (Video Hardware Accelerators).
- TPS65950 Power Management.
- DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
- Available Memory densities:
- 128MByte LPDDR RAM and 256MByte OneNAND flash
- 256MByte LPDDR RAM and 512MByte OneNAND flash
- 512MByte LPDDR RAM and 512MByte OneNAND flash
- GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010).
- WIFI IEEE 802.11b/g (Marvell 88w8686) + Bluetooth 2.0 (CSR Bluecore) with external or Integrated antenna.
- On board microSD Slot.
Processor: OMAP3503 and OMAP3530. Applications Processor with ARM Cortex-A8 CPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration
- Memory:
o 128MByte RAM and 256MByte OneNAND flash
o 512MByte RAM and 512MByte OneNAND flash
* On board microSD slot
* On board USB 2.0 OTG miniAB socket for power and data
* On board USb 2.0 Host interface
* Features
o I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
o Headset, Microphone, backup battery
o USB OTG signals, USB HS Host
* Wireless
o Wifi 802.11 b/g
o Bluetooth 2.0
* Connections
o 2 x 70-pin PCB to PCB connector
o 2 x 27-pin flex ribbon connector
* Size: 18 x 68mm
- Memory:
IGEP MODULE will be offered in various configurations:
- OMAP3530 + wifi + bluetooth + 4GBit RAM + 4GBit ONENAND FLASH
* OMAP3530 + 4GBit RAM + 4GBit ONENAND FLASH
* OMAP3503 + wifi + bluetooth + 1GBit RAM + 2GBit ONENAND FLASH
* OMAP3503 + 1GBit RAM + 2GBit ONENAND FLASH
Prices and availability will be available soon.
Find preliminary specification here.
Please do not hesitate to contact ISEE Sales ( sales@iseebcn.comThis e-mail address is being protected from spambots. You need JavaScript enabled to view it ) for any question.
