Difference between revisions of "IGEP0030 Features"
From IGEP - ISEE Wiki
Manel Caro (talk | contribs) |
Manel Caro (talk | contribs) |
||
| Line 13: | Line 13: | ||
== Platform Description<br> == | == Platform Description<br> == | ||
| − | *[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] and [http://focus.ti.com/paramsearch/docs/parametricsearch.tsp?family=dsp§ionId=2&tabId=2668&familyId=1938¶mCriteria=no TI | + | *[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] and [http://focus.ti.com/paramsearch/docs/parametricsearch.tsp?family=dsp§ionId=2&tabId=2668&familyId=1938¶mCriteria=no TI AM37x] pin compatible family multicore processor. |
*Processors Available OMAP3503, OMAP3515, OMAP3525, [http://labs.igep.es/index.php/OMAP3530 OMAP3530], DM3703, DM3730.<br> | *Processors Available OMAP3503, OMAP3515, OMAP3525, [http://labs.igep.es/index.php/OMAP3530 OMAP3530], DM3703, DM3730.<br> | ||
Revision as of 19:38, 30 June 2010
Contents
IGEP module
IGEP MODULE is the new computer on module designed by ISEE for industrial and commercial market. It's low cost, high performance and production ready module.
IGEP MODULE can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on TI OMAP Application Processor with ARM Cortex-A8 MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.
You don't need anything else than a USB cable to power the IGEP MODULE and communicate with it by using USB OTG interface or wifi/bluetooth interface.
Platform Description
- TI OMAP35x and TI AM37x pin compatible family multicore processor.
- Processors Available OMAP3503, OMAP3515, OMAP3525, OMAP3530, DM3703, DM3730.
- ARM Cortex-A8 core up to 1 Ghz.
- DSP TMS320C64x+ core up to 800 Mhz.
- Imagination Technologies POWERVR SGX 530 core up to 200 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)
- IVA2.2 (Video Hardware Accelerators).
- TPS65950 Power Management.
- DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
- Available Memory densities:
- 128MByte LPDDR RAM and 256MByte OneNAND flash
- 256MByte LPDDR RAM and 512MByte OneNAND flash
- 512MByte LPDDR RAM and 512MByte OneNAND flash
- GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010).
- WIFI IEEE 802.11b/g (Marvell 88w8686) + Bluetooth 2.0 (CSR Bluecore) with external or Integrated antenna.
- On board microSD Slot.
- On board USB 2.0 OTG miniAB socket for power and data.
- On board USB 2.0 Host interface.
- I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
- Keyboard.
- Headset, Microphone, backup battery.
- USB OTG signals, USB HS Host.
- 2 x 70-pin PCB to PCB connector.
- 2 x 27-pin flex ribbon connector.
- Module Size: 18 x 68 mm.
IGEP Module Features
Revision A
xxxxxxxxxxxxxxxxxxxx
Availability
4Q - 2010.
IGEP Module Base board
The base board will be the perfect complement for rapid development in custom designs and it offers a variety of peripherals.
Revision A
- 2 Ethernet Memory Mapped controllers based on SMSC 9221i - 10/100 BaseT.
- VGA.
- DVI-D on HDMI connector.
- LVDS connector.
- Modem GSM/GPRS Quad band telit GE865.
- GPS - TBD.
- WIFI a/b/g/n + Bluetooth + FM radio - TBD.
- SVideo & Composite video output.
- 2 Channels SVideo & Composite Input.
- I/O ...
- TFT ...
Availability
4Q - 2010.
