560
edits
Changes
From IGEP - ISEE Wiki
no edit summary
'''<u>CPU Complex</u>'''
<u>'''Memory'''</u>
<div id="panel3" class="panel-collapse collapse in" role="tabpanel" aria-labelledby="headingOne" aria-expanded="true"><div class="toggle_container">* DDR** 2x32 LP-DDR2, 1x64 DDR3 / LV-DDR3 * NAND ** SLC/MLC, 40-bit ECC, ONFI2.2, DDR
<u>'''Connectivity'''</u>
* S-ATA and PHY
</div>
<u>'''Advanced power management'''</u>
<div id="panel6" class="panel-collapse collapse in" role="tabpanel" aria-labelledby="headingOne"><div class="toggle_container">* PMU integration </div>* [https://www.nxp.com/products/power-management/pmics/configurable-pmics-pf-series/14-channel-configurable-power-management-ic:MMPF0100 NXP PF100 power management unit]
<u>'''Package and temperature'''</u>
<div id="panel8" class="panel-collapse collapse in" role="tabpanel" aria-labelledby="headingOne" aria-expanded="true"><div class="toggle_container">
* 21 x 21mm, 0.8 mm BGA
* Consumer (-20C to +105C), up to 1.2 GHz
* Industrial (-40C to +105C), up to 800 MHz
* Automotive (-40C to +125C), AEC-Q100, up to 1 GHz
</div>
</div>
</div>
==Block diagram==
* [https://www.nxp.com/docs/en/fact-sheet/IMX6SRSFS.pdf i.MX 6 Series of Applications Processors Fact Sheet]
* [https://www.nxp.com/docs/en/reference-manual/IMX6DQRM.pdf i.MX 6Dual/6Quad Applications Processor Reference Manual]
==See also==