Difference between revisions of "IGEPv5"
From IGEP - ISEE Wiki
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===Tutorials=== | ===Tutorials=== | ||
* IGEPv5 Boot Pin-out | * IGEPv5 Boot Pin-out | ||
− | * [index.php/Prepare_a_ready_to_boot_firmware How to prepare a ready to boot firmware] | + | * [http://labs.isee.biz/index.php/Prepare_a_ready_to_boot_firmware How to prepare a ready to boot firmware] |
− | * [ | + | * [[The bootloader U-Boot|U-Boot Bootloader]] |
− | * [ | + | * [[Linux Kernel 4.9.y|Linux Kernel]] |
− | * [index.php/IGEP_Firmware_set-up IGEP Firmware set-up] | + | * [http://labs.isee.biz/index.php/IGEP_Firmware_set-up IGEP Firmware set-up] |
− | * [ | + | * [[How to prepare a bootable MicroSD Card|Boot from MicroSD Card]] |
− | * [ | + | * [[How to Flash the System into the NAND/eMMC|Boot from NAND/eMMC flash.]] |
− | * [index.php/Update_installed_IGEP_Firmware Update Installed IGEP Firmware] | + | * [http://labs.isee.biz/index.php/Update_installed_IGEP_Firmware Update Installed IGEP Firmware] |
===Documentation=== | ===Documentation=== |
Revision as of 11:23, 18 September 2018
Contents
Processor board DUAL core ARM Cortex-A15 up to 1,5 GHz
IGEPv5 is an embedded processor development board based on Texas Instruments OMAP5432 Multimedia Application Device and up to 4 GB DDR3 RAM. This board is designed to evaluate performance and features for advanced industrial applications. This board supports expandability via onboard connectors.
Features |
|
---|---|
Processor |
OMAP5432, by Texas Instruments |
3D/2D Accelerator | 2D GC320 Core from Vivante® Corp Graphics Accelerator 2D/3D Dual Core POWERVR SGX544 Graphics Accelerator |
Video |
DSS Video Display Subsystem (WUXGA) |
Memory | RAM: Up to 4 GB DDR3 Flash: 8 GB eMMC Onboard micro-SD card socket |
Ethernet |
10/100/1000 Mbps Ethernet PHY Interface |
USB |
4 x USB 2.0 Host |
Display |
HDMI 1.4a (with audio), micro HDMI connector |
Image Capture Interface | 1 x MIPI CSI interface (5 lanes) / 1 x CPI interface (16 bits) |
Wireless |
WiFi IEEE 802.11 b/g/n |
Antenna |
1 x Internal WiFi/Bluetooth antenna |
Additional Interfaces |
5 x I2C |
SW Support | Linux Android |
Power Supply | Power from jack power: 5 V |
Power Consumption | Typical 3 W (depending on software) Maximum 6 W (depending on software) |
Thermal | Commercial temperature: 0 ºC to +60 ºC Industrial temperature: -40 ºC to +85 ºC |
Form Factor | 135 mm x 95 mm |
Humidity | 93% relative Humidity at 40 ºC, non-condensing (according to IEC 60068-2-78) |
MTBF | > 100000 hours |
Options |
|
---|---|
Processor |
|
Grade |
|
Main Memory |
|
Flash Memory |
|
Wireless |
|
Firmware
Tutorials
- IGEPv5 Boot Pin-out
- How to prepare a ready to boot firmware
- U-Boot Bootloader
- Linux Kernel
- IGEP Firmware set-up
- Boot from MicroSD Card
- Boot from NAND/eMMC flash.
- Update Installed IGEP Firmware
Documentation
- AM335x
- Pre-installed_software_on_IGEP_Processor_Boards
- Update_the_PRE-INSTALLED_software_image_to_a_current_release