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== VALIDATION OF PROTOTYPES ==
Document: TBD
=== IGEP0040-RA03 version - Micron memory ===
Firsts test applied to 1 hand labeled board:
* Visual mount inspection --> OK
* Check main sources: 5V; 1V8 (WIFI clean); VDDQ; VTT; 1V2; 2V; 1V8 (V_1P8); 3V3 (V_3P3); VCC_MAIN --> OK no SS
* Overall consumption: 5V@0.21A ---> OK, less than Qseven and Sondrio but not dangerous
* Removed Standalone Marvell debug flex connector ---> OK. Broken some NC pads from footprint, but 1.27 mm header can be used
* Add wires to get acces to JTAGB connector ---> OK
* Test 25 MHz crystal --> add R950, because datasheet recomends. OK
* Test power pin decoupling mounted resistors--> OK
* Add PU (4K7) to PRI_TRST into board. The others PU has been added to converter --> OK
* Mounted 26 MHz oscillator --> OK
* Umount all POWER bad resistors --> OK
* Add 330 nF to 3V3 enable LDO to delay 3_3P3 power source (RC: 10K/330nF) ---> OK
* Add 0R to R75 and R80 ---> OK
* Mount R931 to get access directly to eMMC ---> OK
=== Homemade JTAG black stone / JTAGB converter ===
{| align="JUSTIFY" cellpadding="1" border="1" style="width: 300px; height: 1px;"
|-
| '''Signal Name'''
| '''igep0040: JTAGB pos'''
| '''Black Stone pos'''
|-
| V_1P8
| 1
| 1&2
|-
| RESET_OUT
| 2
| NC
|-
| RESET_IN_N2
| 3
| 15
|-
| UART3_TXD0
| 4
| NC
|-
| UART3_RXD0
| 5
| NC
|-
| PRI_TRST_N
| 6
| 3
|-
| PRI_TMS
| 7
| 7
|-
| PRI_TCK
| 8
| 9
|-
| PRI_TDI
| 9
| 5
|-
| PRI_TDO
| 10
| 13
|-
| GND
| 11
| 4
|}
'''NOTE:''' Use PU (10K) from V_1P8 to: PRI_TRST_N, PRI_TDI and PRI_TCK and PRI_TMS
== ISSUES AND IMPROVEMENTS ==
Go to [[IGEP0040HardwareRABugs]] for more information
=== IGEP0040-RA01 version - Hynix memory ===
TBD
=== IGEP0040-RA02 version - Samsung memory ===
=== IGEP0040-RA03 version - Micron memory ===
TBD
=== RA0x common ===
TBD
== TESTS UTILS ==
=== JTAG ===
'''under construction'''
=== Serial debug ===
'''under construction'''
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