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=== Revision A ===
*TI OMAP3503: ARM CORTEX A8 core (600 Mhz)<br>
*[[TPS65950|TPS65950]] power managment
*1 Gb NAND/ 2 Gb Mobile Low Power DDR SDRAM @ 166 Mhz (Package on Package - PoP technology)
*[http://en.wikipedia.org/wiki/IEEE_802.11 [OPTIONAL] Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA).
*[http://en.wikipedia.org/wiki/Bluetooth [OPTIONAL] Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e).
*Integrated antenna and connector for external antenna.
*On board USB 2.0 OTG miniAB socket for power and data.<br>
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>
*Keyboard.
*Headset, Microphone, backup battery.<br>
*USB OTG signals, USB HS Host.
*2 x 70-pin PCB to PCB connector.<br>
*2 x 27-pin flex ribbon connector.<br>
*Module Size: 18 x 68 mm.<br>
*Temperature Range: -40 to +85º C.<br>
*EMI and EMC certificate. CE compliant.
*Only available for medium/high volume orders.
==== Availability<br> ====
2Q - 2010.<br>
<br>
=== Revision B ===
*TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core (720 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
*Keyboard.
*Headset, Microphone, backup battery.<br>
*USB OTG signals, USB HS Host.
*2 x 70-pin PCB to PCB connector.<br>
*2 x 27-pin flex ribbon connector.<br>
*Module Size: 18 x 68 mm.<br>
*Temperature Range: -40 to +85º C.<br>
*EMI and EMC certificate. CE compliant.
*Only available for medium/high volume orders.
==== Availability<br> ====
<br>
