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= IGEP module<br> = [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] is the new computer on module designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE] for industrial and commercial market. It's low cost, high performance and production ready module. [http#REDIRECT://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on [http://www.ti.com/ TI OMAP] Application Processor with [http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.<br> You don't need anything else than a USB cable to power the [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP COM MODULE] and communicate with it by using [http://en.wikipedia.org/wiki/USB_OTG USB OTG] interface or [http://en.wikipedia.org/wiki/Wi-Fi wifi]/[http://en.wikipedia.org/wiki/Bluetooth bluetooth] interface. <br> [[Image:IGEP module.jpg|center]]<br> == Module Features<br> == *[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] and [http://focus.ti.com/paramsearch/docs/parametricsearch.tsp?family=dsp§ionId=2&tabId=2668&familyId=1938¶mCriteria=no TI DM37x] pin compatible family multicore processor. *Processors Available OMAP3503, OMAP3515, OMAP3525, [http://labs.igep.es/index.php/OMAP3530 OMAP3530], DM3703, DM3715.<br> *ARM CORTEX A8 core up to 1 Ghz.<br> *DSP TMS320C64x+ core up to 800 Mhz.<br> *[http://www.imgtec.com/powervr/sgx_series5.asp Imagination Technologies POWERVR SGX 530] core up to 200 Mhz ([http://www.khronos.org/opengles/2_X/ OpenGL® ES 2.0], [http://www.khronos.org/opengles/ OpenGL® ES 1.0] , [http://www.khronos.org/openvg/ OpenVG]) *IVA2.2 (Video Hardware Accelerators). *[[TPS65950]] Power Management.<br>*[http://en.wikipedia.org/wiki/DDR_SDRAM DDR RAM] plus [http://en.wikipedia.org/wiki/Flash_memory NAND Flash] Package on Package (PoP) memories (on OMAP chip). *Available Memory densities:<br> #128MByte LPDDR RAM and 256MByte OneNAND flash<br> #256MByte LPDDR RAM and 512MByte OneNAND flash<br> #512MByte LPDDR RAM and 512MByte OneNAND flash <br> *GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010). *[http://en.wikipedia.org/wiki/WiFi WIFI] IEEE 802.11b/g ([http://www.marvell.com/ Marvell ]88w8686) + Bluetooth 2.0 ([http://www.csr.com/home.php CSR ]Bluecore) with external or Integrated antenna. *On board [http://en.wikipedia.org/wiki/MicroSD microSD] Slot.<br> Processor: OMAP3503 and OMAP3530. Applications Processor with ARM Cortex-A8 CPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration **Memory: <br> o 128MByte RAM and 256MByte OneNAND flash<br> o 512MByte RAM and 512MByte OneNAND flash<br> * On board microSD slot<br> * On board USB 2.0 OTG miniAB socket for power and data<br> * On board USb 2.0 Host interface<br> * Features<br> o I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> o Headset, Microphone, backup battery<br> o USB OTG signals, USB HS Host<br> * Wireless<br> o Wifi 802.11 b/g<br> o Bluetooth 2.0<br> * Connections<br> o 2 x 70-pin PCB to PCB connector<br> o 2 x 27-pin flex ribbon connector<br> * Size: 18 x 68mm IGEP MODULE will be offered in various configurations: *OMAP3530 + wifi + bluetooth + 4GBit RAM + 4GBit ONENAND FLASH<br> * OMAP3530 + 4GBit RAM + 4GBit ONENAND FLASH<br> * OMAP3503 + wifi + bluetooth + 1GBit RAM + 2GBit ONENAND FLASH<br> * OMAP3503 + 1GBit RAM + 2GBit ONENAND FLASH Prices and availability will be available soon. Find preliminary specification here. Please do not hesitate to contact ISEE Sales ( sales@iseebcn.comThis e-mail address is being protected from spambots. You need JavaScript enabled to view it ) for any question.<br>
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