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= IGEP module<br> = [http#REDIRECT://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] is the new computer on module designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE] for industrial and commercial market. It's low cost, high performance and production ready module. [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP COM MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on [http://www.ti.com/ TI OMAP] Application Processor with [http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.<br> You don't need anything else than a USB cable to power the [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] and communicate with it by using [http://en.wikipedia.org/wiki/USB_OTG USB OTG] interface or [http://en.wikipedia.org/wiki/Wi-Fi wifi]/[http://en.wikipedia.org/wiki/Bluetooth bluetooth] interface. <br> [[Image:IGEP module.jpg|center]]<br> == Platform Description<br> == *[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] and [http://focus.ti.com/docs/prod/folders/print/dm3730.html TI DM37x] pin compatible family multicore processor. *Processors Available: OMAP3503 (600Mhz), [http://labs.igep.es/index.php/OMAP3530 OMAP3530] (600 or 720 Mhz), DM3703 (800 Mhz or 1 Ghz), DM3730 (800Mhz or 1 Ghz).<br> *[http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] core up to 1 Ghz.<br> *[http://focus.ti.com/lit/ug/spru871j/spru871j.pdf DSP TMS320C64x+] core up to 800 Mhz.<br> *[http://www.imgtec.com/powervr/sgx_series5.asp Imagination Technologies POWERVR SGX 530] core up to 200 Mhz ([http://www.khronos.org/opengles/2_X/ OpenGL® ES 2.0], [http://www.khronos.org/opengles/ OpenGL® ES 1.0] , [http://www.khronos.org/openvg/ OpenVG]) *IVA2.2 (Video Hardware Accelerators). *[[TPS65950]] Power Management.<br> *[http://en.wikipedia.org/wiki/DDR_SDRAM DDR RAM] plus [http://en.wikipedia.org/wiki/Flash_memory NAND Flash] Package on Package (PoP) memories (on OMAP chip). *Available Memory densities:<br> #128MByte LPDDR RAM and 256MByte OneNAND flash<br> #512MByte LPDDR RAM and 512MByte OneNAND flash<br> *GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010). *[http://en.wikipedia.org/wiki/WiFi WIFI] IEEE 802.11b/g ([http://www.marvell.com/ Marvell ]88w8686) + Bluetooth 2.0 ([http://www.csr.com/home.php CSR ]Bluecore) with external or Integrated antenna. *On board [http://en.wikipedia.org/wiki/MicroSD microSD] Slot.<br> *On board USB 2.0 OTG miniAB socket for power and data.<br> *On board USB 2.0 Host interface.<br> *I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> *Keyboard. *Headset, Microphone, backup battery.<br> *USB OTG signals, USB HS Host.<br> *2 x 70-pin PCB to PCB connector.<br> *2 x 27-pin flex ribbon connector.<br> *Module Size: 18 x 68 mm.<br> <br> == IGEP Module Features<br> == === Revision A === *TI OMAP3503: ARM CORTEX A8 core (600 Mhz)<br> *[[TPS65950|TPS65950]] power managment *1 Gb NAND/ 2 Gb Mobile Low Power DDR SDRAM @ 166 Mhz (Package on Package - PoP technology) *[http://en.wikipedia.org/wiki/IEEE_802.11 [OPTIONAL] Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA). *[http://en.wikipedia.org/wiki/Bluetooth [OPTIONAL] Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e). *Integrated antenna and connector for external antenna. *On board USB 2.0 OTG miniAB socket for power and data.<br> *I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> *Keyboard. *Headset, Microphone, backup battery.<br> *USB OTG signals, USB HS Host. *2 x 70-pin PCB to PCB connector.<br> *2 x 27-pin flex ribbon connector.<br> *Module Size: 18 x 68 mm.<br> *Temperature Range: -40 to +85º C.<br> *EMI and EMC certificate. CE compliant. *Only available for medium/high volume orders. ==== Availability<br> ==== 2Q - 2010.<br> <br> === Revision D === *TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core (720 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz) *[[TPS65950|TPS65950]] power managment *4 Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200 Mhz (Package on Package - PoP technology) *[http://en.wikipedia.org/wiki/IEEE_802.11 Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA) *[http://en.wikipedia.org/wiki/Bluetooth Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e) *Connector for external antenna. *On board USB 2.0 OTG miniAB socket for power and data.<br> *I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> *Keyboard. *Headset, Microphone, backup battery.<br> *USB OTG signals, USB HS Host. *2 x 70-pin PCB to PCB connector.<br> *2 x 27-pin flex ribbon connector.<br> *Module Size: 18 x 68 mm.<br> *Temperature Range: -40 to +85º C. (Optional)<br> *EMI and EMC certificate. CE compliant.<br> *Max. Video Resolution 1080P, 720P. *Video encoding & decoding up to D1 resolution. ==== Availability<br> ==== 3Q - 2010.<br> === Revision E === *TI OMAP - [http://focus.ti.com/docs/prod/folders/print/dm3730.html DM3730]: ARM CORTEX A8 core (1Ghz) + POWERVR SGX 530 core (200 Mhz) + IVA2.2 + DSP TMS320C64x+ (800Mhz) *[[TPS65950|TPS65950]] power managment *4 Gbit NAND/ 4Gbit Mobile Low Power DDR SDRAM @ 200 Mhz (Package on Package - PoP technology) *[http://en.wikipedia.org/wiki/IEEE_802.11 Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA) *[http://en.wikipedia.org/wiki/Bluetooth Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e) *Integrated antenna and connector for external antenna. *On board USB 2.0 OTG miniAB socket for power and data.<br> *I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> *Keyboard. *Headset, Microphone, backup battery.<br> *USB OTG signals, USB HS Host. *2 x 70-pin PCB to PCB connector.<br> *2 x 27-pin flex ribbon connector.<br> *Module Size: 18 x 68 mm.<br> *Temperature Range: -40 to +85º C.<br> *EMI and EMC certificate. CE compliant.<br> *Max. Video Resolution (DSS) 1080P, 720P. *Video encoding & decoding up to 720P resolution. ==== Availability<br> ==== 1Q - 2011. <br> <br> == IGEP Module Base board == The base board will be the perfect complement for rapid development in custom designs and it offers a variety of peripherals.<br> === Revision A === *2 Ethernet Memory Mapped controllers based on SMSC 9221i - 10/100 BaseT.<br> *DVI-D on HDMI connector.<br> *2 - LAN9221 Industrial Ethernet 10/100 Mb BaseT. *1 - USB Host on USB-A connector *1 - Input Stereo Audio Line Jack. *1 - Output Stereo Audio Line Jack. *1 - DB9 (RS232 UART3 - DEBUG Console) *2 - RED leds. *1 - Power jack 5VDC Input. *1 - User button *Board Size: 195 x 132 mm. ==== Availability<br> ==== 1Q - 2011.<br> <br> = Useful Links = *[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 Product website] *[[IGEP_module_standalone]]
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