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IGEP0030 Features

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= IGEP module<br> =
ISEE [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE ] is the new computer on module designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE ] for industrial and commercial market, that communicates via 802.11b/g, Bluetooth 2.0 and USB, is It's low cost, high performance and production readymodule.
[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard. <br>
You don't need anything else than a USB cable to power the [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] and communicate with it by using [http://en.wikipedia.org/wiki/USB_OTG USB OTG] interface or [http://en.wikipedia.org/wiki/Wi-Fi wifi]/[http://en.wikipedia.org/wiki/Bluetooth bluetooth] interface.
[[Image:IGEP_module.jpg|center]]<br>
== Module Features<br> ==
IGEP MODULE can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard*[http://focus. You don't need anything else than a USB cable to power the IGEP MODULE and communicate with it by using USB OTG interfaceti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] pin compatible family multicore processor.
*Processors Available OMAP3503, OMAP3515, OMAP3525, [[../../../../index.php/OMAP3530|OMAP3530]], DM3703, DM3715.<br> *ARM CORTEX A8 core up to 1 Ghz.<br> *DSP TMS320C64x+ core up to 800 Mhz.<br> *POWERVR SGX 530 core up to 200 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG) *IVA2.2 (Video Hardware Accelerators) *[[../../../../index.php/TPS65950|TPS65950]] Power Management *DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip). *Memory densities available:<br> #128MByte RAM and 256MByte OneNAND flash<br>#256MByte RAM and 512MByte OneNAND flash [[|]]<br>#512MByte RAM and 512MByte OneNAND flash <br> *Linux BSP available (Board Support Package) and Windows CE (Under Development, Available OCT/2010).*WIFI IEEE 802.11b/g + Bluetooth 2.0 (Integrated antenna).*<br> Processor: OMAP3503 and OMAP3530. Applications Processor with ARM Cortex-A8 CPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration<br>  ** Memory: <br> o 128MByte RAM and 256MByte OneNAND flash<br> o 512MByte RAM and 512MByte OneNAND flash<br> * On board microSD slot<br> * On board USB 2.0 OTG miniAB socket for power and data<br> * On board USb 2.0 Host interface<br> * Features<br> o I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br> o Headset, Microphone, backup battery<br> o USB OTG signals, USB HS Host<br> * Wireless<br> o Wifi 802.11 b/g<br> o Bluetooth 2.0<br> * Connections<br> o 2 x 70-pin PCB to PCB connector<br> o 2 x 27-pin flex ribbon connector<br> * Size: 18 x 68mm
IGEP MODULE will be offered in various configurations:
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