BASE0010 Features
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Contents
IGEP BASE BOARD
IGEP BASE BOARD is the new hardware board designed by ISEE for industrial and commercial market.
IGEP BASE BOARD is intended to be used as an expansion board to have access to a wide range of functionalities offered by IGEP computer-on-module boards like IGEP MODULE or IGEP SoM: ETHERNET, RS232, USB, AUDIO, VIDEO, etc.
TI OMAP Application Processor with ARM Cortex-A8 MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.
Platform Description
- TI OMAP35x and TI DM37x pin compatible family multicore processor.
- Processors Available: OMAP3503 (600Mhz), OMAP3530 (600 or 720 Mhz), DM3703 (800 Mhz or 1 Ghz), DM3730 (800Mhz or 1 Ghz).
- ARM Cortex-A8 core up to 1 Ghz.
- DSP TMS320C64x+ core up to 800 Mhz.
- Imagination Technologies POWERVR SGX 530 core up to 2
00 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)
- IVA2.2 (Video Hardware Accelerators).
- TPS65950 Power Management.
- DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
- Available Memory densities:
- 128MByte LPDDR RAM and 256MByte OneNAND flash
- 512MByte LPDDR RAM and 512MByte OneNAND flash
- GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010).
- WIFI IEEE 802.11b/g (Marvell 88w8686) + Bluetooth 2.0 (CSR Bluecore) with external or Integrated antenna.
- On board microSD Slot.
- On board USB 2.0 OTG miniAB socket for power
and data.
- On board USB 2.0 Host interface.
- I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
- Keyboard.
- Headset, Microphone, backup battery.
- USB OTG signals, USB HS Host.
- 2 x 70-pin PCB to PCB connector.
- 2 x 27-pin flex ribbon connector.
- Module Size: 18 x 68 mm.
IGEP Base Board Features
Revision A
- 2 Ethernet Memory Mapped controllers based on SMSC 9221i - 10/100 BaseT.
- VGA Standard connector
- DVI-D on HDMI connector
- LVDS connector.
- Modem GSM/GPRS Quad band telit GE865.
- GPS - TBD.
- WIFI a/b/g/n + Bluetooth + FM radio - TBD.
- SVideo & Composite video output.
- 2 Channels SVideo & Composite Input based on TVP5151.
- I/O [TBD]
- TFT (2 outputs with touch controller) [TBD]
Revision B
- TI OMAP3530: ARM CORTEX A8 core (720 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
- TPS65950 power managment
- 4 Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200 Mhz (Package on Package - PoP technology)
- Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
- Bluetooth 2.0 (CSR BC4ROM/21e)
- Integrated antenna and connector for external antenna.
- On board USB 2.0 OTG miniAB socket for power and data.
- I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
- Keyboard.
- Headset, Microphone, backup battery.
- USB OTG signals, USB HS Host.
- 2 x 70-pin PCB to PCB connector.
- 2 x 27-pin flex ribbon connector.
- Module Size: 18 x 68 mm.
- Temperature Range: -40 to +85º C. (Optional)
- EMI and EMC certificate. CE compliant.
Availability
3Q - 2010.
IGEP Platforms Supported
The base board will be the perfect complement for rapid development in custom designs and it offers a variety of peripherals.
Revision A
- IGEP MODULE
- TI OMAP Application Processor with ARM Cortex-A8 MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.
- TI DM37x pin compatible family multicore processor.
Revision B
Availability
1Q - 2011.
