Difference between revisions of "BASE0010 Features"

From IGEP - ISEE Wiki

Jump to: navigation, search
Line 1: Line 1:
 
= IGEP BASE BOARD<br>  =
 
= IGEP BASE BOARD<br>  =
  
[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] is the new computer on module designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE] for industrial and commercial market. It's low cost, high performance and production ready module.  
+
[http://www.igep.es/index.php?option=com_content&view=article&id=115&Itemid=124 IGEP BASE BOARD] is the new hardware board designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE] for industrial and commercial market. It's low cost, high performance and production ready module.  
  
 
[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on [http://www.ti.com/ TI OMAP]&nbsp;Application Processor with [http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.<br>  
 
[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on [http://www.ti.com/ TI OMAP]&nbsp;Application Processor with [http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.<br>  
Line 15: Line 15:
 
<br>  
 
<br>  
  
[[Image:AABASE-BOT-FRONTALm2.jpg|IGEP BASE BOARD]]
+
 
  
 
<br>  
 
<br>  
Line 30: Line 30:
 
*[http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] core up to 1 Ghz.<br>  
 
*[http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] core up to 1 Ghz.<br>  
 
*[http://focus.ti.com/lit/ug/spru871j/spru871j.pdf DSP TMS320C64x+] core up to 800 Mhz.<br>  
 
*[http://focus.ti.com/lit/ug/spru871j/spru871j.pdf DSP TMS320C64x+] core up to 800 Mhz.<br>  
*[http://www.imgtec.com/powervr/sgx_series5.asp Imagination Technologies POWERVR SGX 530] core up to 200 Mhz ([http://www.khronos.org/opengles/2_X/ OpenGL® ES 2.0], [http://www.khronos.org/opengles/ OpenGL® ES 1.0] , [http://www.khronos.org/openvg/ OpenVG])  
+
*[http://www.imgtec.com/powervr/sgx_series5.asp Imagination Technologies POWERVR SGX 530] core up to 2
 +
 
 +
00 Mhz ([http://www.khronos.org/opengles/2_X/ OpenGL® ES 2.0], [http://www.khronos.org/opengles/ OpenGL® ES 1.0] , [http://www.khronos.org/openvg/ OpenVG])  
 
*IVA2.2 (Video Hardware Accelerators).  
 
*IVA2.2 (Video Hardware Accelerators).  
 
*[[TPS65950]] Power Management.<br>  
 
*[[TPS65950]] Power Management.<br>  
Line 42: Line 44:
 
*[http://en.wikipedia.org/wiki/WiFi WIFI] IEEE 802.11b/g ([http://www.marvell.com/ Marvell ]88w8686) + Bluetooth 2.0 ([http://www.csr.com/home.php CSR ]Bluecore) with external or Integrated antenna.  
 
*[http://en.wikipedia.org/wiki/WiFi WIFI] IEEE 802.11b/g ([http://www.marvell.com/ Marvell ]88w8686) + Bluetooth 2.0 ([http://www.csr.com/home.php CSR ]Bluecore) with external or Integrated antenna.  
 
*On board [http://en.wikipedia.org/wiki/MicroSD microSD] Slot.<br>  
 
*On board [http://en.wikipedia.org/wiki/MicroSD microSD] Slot.<br>  
*On board USB 2.0 OTG miniAB socket for power and data.<br>  
+
*On board USB 2.0 OTG miniAB socket for power  
 +
 
 +
and data.<br>  
 
*On board USB 2.0 Host interface.<br>  
 
*On board USB 2.0 Host interface.<br>  
 
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>  
 
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>  
Line 49: Line 53:
 
*USB OTG signals, USB HS Host.<br>  
 
*USB OTG signals, USB HS Host.<br>  
 
*2 x 70-pin PCB to PCB connector.<br>  
 
*2 x 70-pin PCB to PCB connector.<br>  
*2 x 27-pin flex ribbon connector.<br>  
+
*2 x 27-pin flex ribbon connector.<br>
 +
 
 +
 
 
*Module Size: 18 x 68 mm.<br>
 
*Module Size: 18 x 68 mm.<br>
  
 
<br>  
 
<br>  
  
== IGEP Module Features<br>  ==
+
== IGEP Base Board Features<br>  ==
  
 
=== Revision A  ===
 
=== Revision A  ===
  
*TI OMAP3503: ARM CORTEX A8 core (600 Mhz)<br>
+
[[Image:AABASE-BOT-FRONTALm2.jpg|470x198px|IGEP BASE BOARD]]  
*[[TPS65950|TPS65950]] power managment
 
*1 Gb NAND/ 2 Gb Mobile Low Power DDR SDRAM @ 166 Mhz (Package on Package - PoP technology)
 
*[http://en.wikipedia.org/wiki/IEEE_802.11 [OPTIONAL] Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA).
 
*[http://en.wikipedia.org/wiki/Bluetooth [OPTIONAL] Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e).
 
*Integrated antenna and connector for external antenna.
 
*On board USB 2.0 OTG miniAB socket for power and data.<br>
 
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>
 
*Keyboard.
 
*Headset, Microphone, backup battery.<br>
 
*USB OTG signals, USB HS Host.
 
*2 x 70-pin PCB to PCB connector.<br>
 
*2 x 27-pin flex ribbon connector.<br>
 
*Module Size: 18 x 68 mm.<br>
 
*Temperature Range: -40 to +85º C.<br>
 
*EMI and EMC certificate. CE compliant.
 
*Only available for medium/high volume orders.
 
  
==== Availability<br> ====
+
*2 Ethernet Memory Mapped controllers based on SMSC 9221i - 10/100 BaseT.<br>  
 +
*VGA Standard connector
 +
*DVI-D on HDMI connector
 +
*LVDS connector.
  
2Q - 2010.<br>
 
  
 +
*Modem GSM/GPRS Quad band telit GE865.
 +
*GPS - TBD.
 +
*WIFI a/b/g/n + Bluetooth + FM radio - TBD.
 +
*SVideo &amp; Composite video output.
 +
*2 Channels SVideo &amp; Composite Input based on TVP5151.
 +
*I/O [TBD]
 +
*TFT (2 outputs with touch controller) [TBD]
 +
<br>
 
<br>  
 
<br>  
  
 
=== Revision B  ===
 
=== Revision B  ===
 +
 +
 +
 +
 +
 +
  
 
*TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core (720 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)  
 
*TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core (720 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)  

Revision as of 16:03, 16 March 2011

IGEP BASE BOARD

IGEP BASE BOARD is the new hardware board designed by ISEE for industrial and commercial market. It's low cost, high performance and production ready module.

IGEP MODULE can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on TI OMAP Application Processor with ARM Cortex-A8 MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.

You don't need anything else than a USB cable to power the IGEP MODULE and communicate with it by using USB OTG interface or wifi/bluetooth interface.

IGEP BASE BOARD revB








Platform Description

00 Mhz (OpenGL® ES 2.0, OpenGL® ES 1.0 , OpenVG)

  • IVA2.2 (Video Hardware Accelerators).
  • TPS65950 Power Management.
  • DDR RAM plus NAND Flash Package on Package (PoP) memories (on OMAP chip).
  • Available Memory densities:
  1. 128MByte LPDDR RAM and 256MByte OneNAND flash
  2. 512MByte LPDDR RAM and 512MByte OneNAND flash
  • GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010).
  • WIFI IEEE 802.11b/g (Marvell 88w8686) + Bluetooth 2.0 (CSR Bluecore) with external or Integrated antenna.
  • On board microSD Slot.
  • On board USB 2.0 OTG miniAB socket for power

and data.

  • On board USB 2.0 Host interface.
  • I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
  • Keyboard.
  • Headset, Microphone, backup battery.
  • USB OTG signals, USB HS Host.
  • 2 x 70-pin PCB to PCB connector.
  • 2 x 27-pin flex ribbon connector.


  • Module Size: 18 x 68 mm.


IGEP Base Board Features

Revision A

IGEP BASE BOARD

  • 2 Ethernet Memory Mapped controllers based on SMSC 9221i - 10/100 BaseT.
  • VGA Standard connector
  • DVI-D on HDMI connector
  • LVDS connector.


  • Modem GSM/GPRS Quad band telit GE865.
  • GPS - TBD.
  • WIFI a/b/g/n + Bluetooth + FM radio - TBD.
  • SVideo & Composite video output.
  • 2 Channels SVideo & Composite Input based on TVP5151.
  • I/O [TBD]
  • TFT (2 outputs with touch controller) [TBD]



Revision B

  • TI OMAP3530: ARM CORTEX A8 core (720 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
  • TPS65950 power managment
  • 4 Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200 Mhz (Package on Package - PoP technology)
  • Wifi IEEE 802.11b/g (Marvell 86w8686B1 information under NDA)
  • Bluetooth 2.0 (CSR BC4ROM/21e)
  • Integrated antenna and connector for external antenna.
  • On board USB 2.0 OTG miniAB socket for power and data.
  • I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.
  • Keyboard.
  • Headset, Microphone, backup battery.
  • USB OTG signals, USB HS Host.
  • 2 x 70-pin PCB to PCB connector.
  • 2 x 27-pin flex ribbon connector.
  • Module Size: 18 x 68 mm.
  • Temperature Range: -40 to +85º C. (Optional)
  • EMI and EMC certificate. CE compliant.

Availability

3Q - 2010.


IGEP Module Base board

The base board will be the perfect complement for rapid development in custom designs and it offers a variety of peripherals.

Revision A

  • 2 Ethernet Memory Mapped controllers based on SMSC 9221i - 10/100 BaseT.
  • VGA Standard connector.
  • DVI-D on HDMI connector.
  • LVDS connector.
  • Modem GSM/GPRS Quad band telit GE865.
  • GPS - TBD.
  • WIFI a/b/g/n + Bluetooth + FM radio - TBD.
  • SVideo & Composite video output.
  • 2 Channels SVideo & Composite Input based on TVP5151.
  • I/O [TBD]
  • TFT (2 outputs with touch controller) [TBD]


Availability

1Q - 2011.


Useful Links