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Created page with '= IGEP BASE BOARD<br> = [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] is the new computer on module designed by [http://www.igep.…'
= IGEP BASE BOARD<br> =
[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] is the new computer on module designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE] for industrial and commercial market. It's low cost, high performance and production ready module.
[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on [http://www.ti.com/ TI OMAP] Application Processor with [http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.<br>
You don't need anything else than a USB cable to power the [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] and communicate with it by using [http://en.wikipedia.org/wiki/USB_OTG USB OTG] interface or [http://en.wikipedia.org/wiki/Wi-Fi wifi]/[http://en.wikipedia.org/wiki/Bluetooth bluetooth] interface.
<br>
[[Image:IGEP module.jpg|center]]<br>
== Platform Description<br> ==
*[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] and [http://focus.ti.com/docs/prod/folders/print/dm3730.html TI DM37x] pin compatible family multicore processor.
*Processors Available: OMAP3503 (600Mhz), [http://labs.igep.es/index.php/OMAP3530 OMAP3530] (600 or 720 Mhz), DM3703 (800 Mhz or 1 Ghz), DM3730 (800Mhz or 1 Ghz).<br>
*[http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] core up to 1 Ghz.<br>
*[http://focus.ti.com/lit/ug/spru871j/spru871j.pdf DSP TMS320C64x+] core up to 800 Mhz.<br>
*[http://www.imgtec.com/powervr/sgx_series5.asp Imagination Technologies POWERVR SGX 530] core up to 200 Mhz ([http://www.khronos.org/opengles/2_X/ OpenGL® ES 2.0], [http://www.khronos.org/opengles/ OpenGL® ES 1.0] , [http://www.khronos.org/openvg/ OpenVG])
*IVA2.2 (Video Hardware Accelerators).
*[[TPS65950]] Power Management.<br>
*[http://en.wikipedia.org/wiki/DDR_SDRAM DDR RAM] plus [http://en.wikipedia.org/wiki/Flash_memory NAND Flash] Package on Package (PoP) memories (on OMAP chip).
*Available Memory densities:<br>
#128MByte LPDDR RAM and 256MByte OneNAND flash<br>
#512MByte LPDDR RAM and 512MByte OneNAND flash<br>
*GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010).
*[http://en.wikipedia.org/wiki/WiFi WIFI] IEEE 802.11b/g ([http://www.marvell.com/ Marvell ]88w8686) + Bluetooth 2.0 ([http://www.csr.com/home.php CSR ]Bluecore) with external or Integrated antenna.
*On board [http://en.wikipedia.org/wiki/MicroSD microSD] Slot.<br>
*On board USB 2.0 OTG miniAB socket for power and data.<br>
*On board USB 2.0 Host interface.<br>
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>
*Keyboard.
*Headset, Microphone, backup battery.<br>
*USB OTG signals, USB HS Host.<br>
*2 x 70-pin PCB to PCB connector.<br>
*2 x 27-pin flex ribbon connector.<br>
*Module Size: 18 x 68 mm.<br>
<br>
== IGEP Module Features<br> ==
=== Revision A ===
*TI OMAP3503: ARM CORTEX A8 core (600 Mhz)<br>
*[[TPS65950|TPS65950]] power managment
*1 Gb NAND/ 2 Gb Mobile Low Power DDR SDRAM @ 166 Mhz (Package on Package - PoP technology)
*[http://en.wikipedia.org/wiki/IEEE_802.11 [OPTIONAL] Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA).
*[http://en.wikipedia.org/wiki/Bluetooth [OPTIONAL] Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e).
*Integrated antenna and connector for external antenna.
*On board USB 2.0 OTG miniAB socket for power and data.<br>
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>
*Keyboard.
*Headset, Microphone, backup battery.<br>
*USB OTG signals, USB HS Host.
*2 x 70-pin PCB to PCB connector.<br>
*2 x 27-pin flex ribbon connector.<br>
*Module Size: 18 x 68 mm.<br>
*Temperature Range: -40 to +85º C.<br>
*EMI and EMC certificate. CE compliant.
*Only available for medium/high volume orders.
==== Availability<br> ====
2Q - 2010.<br>
<br>
=== Revision B ===
*TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core (720 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
*[[TPS65950|TPS65950]] power managment
*4 Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200 Mhz (Package on Package - PoP technology)
*[http://en.wikipedia.org/wiki/IEEE_802.11 Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA)
*[http://en.wikipedia.org/wiki/Bluetooth Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e)
*Integrated antenna and connector for external antenna.
*On board USB 2.0 OTG miniAB socket for power and data.<br>
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>
*Keyboard.
*Headset, Microphone, backup battery.<br>
*USB OTG signals, USB HS Host.
*2 x 70-pin PCB to PCB connector.<br>
*2 x 27-pin flex ribbon connector.<br>
*Module Size: 18 x 68 mm.<br>
*Temperature Range: -40 to +85º C. (Optional)<br>
*EMI and EMC certificate. CE compliant.<br>
==== Availability<br> ====
3Q - 2010.<br>
<br>
== IGEP Module Base board ==
The base board will be the perfect complement for rapid development in custom designs and it offers a variety of peripherals.<br>
=== Revision A ===
*2 Ethernet Memory Mapped controllers based on SMSC 9221i - 10/100 BaseT.<br>
*VGA Standard connector.
*DVI-D on HDMI connector.
*LVDS connector.
*Modem GSM/GPRS Quad band telit GE865.
*GPS - TBD.
*WIFI a/b/g/n + Bluetooth + FM radio - TBD.
*SVideo & Composite video output.
*2 Channels SVideo & Composite Input based on TVP5151.
*I/O [TBD]
*TFT (2 outputs with touch controller) [TBD]
<br>
==== Availability<br> ====
1Q - 2011.<br>
<br>
= Useful Links =
*[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 Product website]
[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] is the new computer on module designed by [http://www.igep.es/index.php?option=com_content&view=article&id=52&Itemid=108 ISEE] for industrial and commercial market. It's low cost, high performance and production ready module.
[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] can be used as a computer-on-module for your product but also as an stand alone computer without the need of a baseboard based on [http://www.ti.com/ TI OMAP] Application Processor with [http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] MPU, a C64x+ digital signal processor (DSP) core, and the POWERVR SGX for 2D and 3D graphics acceleration.<br>
You don't need anything else than a USB cable to power the [http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 IGEP MODULE] and communicate with it by using [http://en.wikipedia.org/wiki/USB_OTG USB OTG] interface or [http://en.wikipedia.org/wiki/Wi-Fi wifi]/[http://en.wikipedia.org/wiki/Bluetooth bluetooth] interface.
<br>
[[Image:IGEP module.jpg|center]]<br>
== Platform Description<br> ==
*[http://focus.ti.com/dsp/docs/dspcontent.tsp?contentId=53403 TI OMAP35x] and [http://focus.ti.com/docs/prod/folders/print/dm3730.html TI DM37x] pin compatible family multicore processor.
*Processors Available: OMAP3503 (600Mhz), [http://labs.igep.es/index.php/OMAP3530 OMAP3530] (600 or 720 Mhz), DM3703 (800 Mhz or 1 Ghz), DM3730 (800Mhz or 1 Ghz).<br>
*[http://www.arm.com/products/processors/cortex-a/cortex-a8.php ARM Cortex-A8] core up to 1 Ghz.<br>
*[http://focus.ti.com/lit/ug/spru871j/spru871j.pdf DSP TMS320C64x+] core up to 800 Mhz.<br>
*[http://www.imgtec.com/powervr/sgx_series5.asp Imagination Technologies POWERVR SGX 530] core up to 200 Mhz ([http://www.khronos.org/opengles/2_X/ OpenGL® ES 2.0], [http://www.khronos.org/opengles/ OpenGL® ES 1.0] , [http://www.khronos.org/openvg/ OpenVG])
*IVA2.2 (Video Hardware Accelerators).
*[[TPS65950]] Power Management.<br>
*[http://en.wikipedia.org/wiki/DDR_SDRAM DDR RAM] plus [http://en.wikipedia.org/wiki/Flash_memory NAND Flash] Package on Package (PoP) memories (on OMAP chip).
*Available Memory densities:<br>
#128MByte LPDDR RAM and 256MByte OneNAND flash<br>
#512MByte LPDDR RAM and 512MByte OneNAND flash<br>
*GNU Linux 2.6.28 and 2.6.33 BSP available (Board Support Package) and Windows CE 6 (Under Development, Available OCT/2010).
*[http://en.wikipedia.org/wiki/WiFi WIFI] IEEE 802.11b/g ([http://www.marvell.com/ Marvell ]88w8686) + Bluetooth 2.0 ([http://www.csr.com/home.php CSR ]Bluecore) with external or Integrated antenna.
*On board [http://en.wikipedia.org/wiki/MicroSD microSD] Slot.<br>
*On board USB 2.0 OTG miniAB socket for power and data.<br>
*On board USB 2.0 Host interface.<br>
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>
*Keyboard.
*Headset, Microphone, backup battery.<br>
*USB OTG signals, USB HS Host.<br>
*2 x 70-pin PCB to PCB connector.<br>
*2 x 27-pin flex ribbon connector.<br>
*Module Size: 18 x 68 mm.<br>
<br>
== IGEP Module Features<br> ==
=== Revision A ===
*TI OMAP3503: ARM CORTEX A8 core (600 Mhz)<br>
*[[TPS65950|TPS65950]] power managment
*1 Gb NAND/ 2 Gb Mobile Low Power DDR SDRAM @ 166 Mhz (Package on Package - PoP technology)
*[http://en.wikipedia.org/wiki/IEEE_802.11 [OPTIONAL] Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA).
*[http://en.wikipedia.org/wiki/Bluetooth [OPTIONAL] Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e).
*Integrated antenna and connector for external antenna.
*On board USB 2.0 OTG miniAB socket for power and data.<br>
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>
*Keyboard.
*Headset, Microphone, backup battery.<br>
*USB OTG signals, USB HS Host.
*2 x 70-pin PCB to PCB connector.<br>
*2 x 27-pin flex ribbon connector.<br>
*Module Size: 18 x 68 mm.<br>
*Temperature Range: -40 to +85º C.<br>
*EMI and EMC certificate. CE compliant.
*Only available for medium/high volume orders.
==== Availability<br> ====
2Q - 2010.<br>
<br>
=== Revision B ===
*TI [[OMAP3530|OMAP3530]]: ARM CORTEX A8 core (720 Mhz) + POWERVR SGX 530 core (110Mhz) + IVA2.2 + DSP TMS320C64x+ (520Mhz)
*[[TPS65950|TPS65950]] power managment
*4 Gb NAND/ 4Gb Mobile Low Power DDR SDRAM @ 200 Mhz (Package on Package - PoP technology)
*[http://en.wikipedia.org/wiki/IEEE_802.11 Wifi IEEE 802.11b/g] ([http://www.marvell.com/ Marvell] 86w8686B1 information under NDA)
*[http://en.wikipedia.org/wiki/Bluetooth Bluetooth] 2.0 ([http://www.csr.com/home.php CSR] BC4ROM/21e)
*Integrated antenna and connector for external antenna.
*On board USB 2.0 OTG miniAB socket for power and data.<br>
*I2C, PWM lines (6), A/D (6), 1-wire, UART, SPI, Camera in, Extra MMC lines.<br>
*Keyboard.
*Headset, Microphone, backup battery.<br>
*USB OTG signals, USB HS Host.
*2 x 70-pin PCB to PCB connector.<br>
*2 x 27-pin flex ribbon connector.<br>
*Module Size: 18 x 68 mm.<br>
*Temperature Range: -40 to +85º C. (Optional)<br>
*EMI and EMC certificate. CE compliant.<br>
==== Availability<br> ====
3Q - 2010.<br>
<br>
== IGEP Module Base board ==
The base board will be the perfect complement for rapid development in custom designs and it offers a variety of peripherals.<br>
=== Revision A ===
*2 Ethernet Memory Mapped controllers based on SMSC 9221i - 10/100 BaseT.<br>
*VGA Standard connector.
*DVI-D on HDMI connector.
*LVDS connector.
*Modem GSM/GPRS Quad band telit GE865.
*GPS - TBD.
*WIFI a/b/g/n + Bluetooth + FM radio - TBD.
*SVideo & Composite video output.
*2 Channels SVideo & Composite Input based on TVP5151.
*I/O [TBD]
*TFT (2 outputs with touch controller) [TBD]
<br>
==== Availability<br> ====
1Q - 2011.<br>
<br>
= Useful Links =
*[http://www.igep.es/index.php?option=com_content&view=article&id=109&Itemid=123 Product website]