Difference between revisions of "IGEP COM MODULE"

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===Yocto===
 
===Yocto===
* [[How to use the Yocto Project to develop Embedded Linux]]
 
 
 
==Firmware==
 
===Tutorials===
 
* IGEP COM MODULE Boot Pin-out
 
* [http://labs.isee.biz/index.php/Prepare_a_ready_to_boot_firmware How to prepare a ready to boot firmware]
 
* [[The bootloader U-Boot|U-Boot Bootloader]]
 
* [[Linux Kernel 4.9.y|Linux Kernel]]
 
* [http://labs.isee.biz/index.php/IGEP_Firmware_set-up IGEP Firmware set-up]
 
* [[How to prepare a bootable MicroSD Card|Boot from MicroSD Card]]
 
* [[How to Flash the System into the NAND/eMMC|Boot from NAND/eMMC flash.]]
 
* [http://labs.isee.biz/index.php/Update_installed_IGEP_Firmware Update Installed IGEP Firmware]
 
 
===Documentation===
 
* [[DM3730|IGEP COM MODULE SoC: DM3730]]
 
* [http://downloads.isee.biz/pub/documentation/Platform_Boards/IGEP_COM_Module/Datasheet/IGEP_COM_MODULE_DATASHEET_20160712.pdf Datasheet]
 
* [http://downloads.isee.biz/pub/documentation/Platform_Boards/IGEP_COM_Module/Mechanical/MEC-PR-IGEP.0030-001.01-DRAWING.pdf Mechanical]
 
* Software Manual
 
* [http://downloads.isee.biz/pub/documentation/Platform_Boards/IGEP_COM_Module/Manuals/MAN-IGEP0030-RGx-IGEP_COM_MODULE_HARDWARE_REFERENCE_MANUAL-20160607.pdf Hardware Manual]
 
 
===Software===
 
* [http://labs.isee.biz/index.php/IGEP_Firmware_set-up#Install_IGEP_Firmware_on_bootable_SD-card Official IGEP Firmware]
 
* [http://downloads.isee.biz/pub/relaunch/rootfs/ubuntu/xenial/ubuntu-xenial-armhf-igep-base-v0.01.tgz Ubuntu Xenial 16.04 LTS ARM Hard Float]
 
* [http://downloads.isee.biz/pub/relaunch/rootfs/debian/stretch/debian-stretch-armhf-igep-base-v0.01.tgz Debian Stretch ARM Hard Float]
 
* [http://downloads.isee.biz/pub/relaunch/rootfs/yocto/pyro/minimal/igep0030hf-yocto-pyro-minimal-base-v0.01.bz2 Yocto Pyro ARM Hard Float]
 
* [http://downloads.isee.biz/pub/relaunch/rootfs/buildroot/skeltal/igep-buildroot-skeltal-base-v0.01.bz2 Buildroot ARM Hard Float]
 
 
==<span dir="auto">Getting started with IGEP COM MODULE<br /></span>==
 
* [[Getting started with IGEP COM MODULE|Getting Started with IGEP COM MODULE]]
 
 
==<span id="Yocto_Guides" class="mw-headline">Yocto Guides</span>==
 
 
* [[How to use the Yocto Project to develop Embedded Linux]]
 
* [[How to use the Yocto Project to develop Embedded Linux]]
  
 
[[Category:IGEP0030]]
 
[[Category:IGEP0030]]

Revision as of 10:13, 25 September 2018

Small module SINGLE core ARM Cortex-A8 up to 1000 MHz

Com Module W 03.jpg

The IGEP COM MODULE is an industrial processor board. It can be used as a computer-on-module for your product. The IGEP COM MODULE provides a lot of features in a small size. You can build your project anywhere you want.


Features

Processor

DM3730 / AM3703, by Texas Instruments
ARM Cortex-A8
NEON SIMD Coprocessor
Frequency speed 1000 MHz
TMS320C64+ DSP 800 MHz (Only in DM3730 version)

3D/2D Accelerator PowerVR SGX GPU, providing graphics acceleration with OpenGL ES1.0, OpenGL ES2.0 and OpenVG support (Only in DM3730 version)
Video

Video acceleration: H.264, H.263, MPEG-4, MPEG-2, JPEG, WMV9 and additional codecs. Video encoder/decoder up to 720p (Only in DM3730 version)

Memory RAM: Up to 512 MB Mobile DDR (Standard setup 512 MB)
Flash: Up to 512 MB (Standard setup 512 MB)
Onboard micro-SD card socket
Ethernet

No

USB

1 x USB 2.0 Host (connector not included)
1 x USB 2.0 OTG

Display

1 x Digital Video/TFT interface
Resolution 2048 x 2048 – 24 bits
1 x Analog S-Video interface (Optional)

Image Capture Interface 1 x CPI interface (12 bits)
Wireless

WiFi IEEE 802.11 b/g/n (Access Point: Yes)
Bluetooth v4.0 (BLE)

Antenna

1 x Internal WiFi/Bluetooth antenna
1 x U.FL connector for external antenna

Additional Interfaces


(Other combinations available, see Hardware Manual for more information)

4 x UART
1 x I2C
1 x MMC (No WiFi version)
1 x I2S
1 x GPMC
1 x Analog Audio In
1 x Audio Out
2 x SPI
76 x GPIO (Maximum number of GPIOs)
5 x Analog-to-Digital Converter
4 x PWM

SW Support Linux
Android
Power Supply Power from expansion connectors: From 3,5 V to 4,2 V
Digital I/O voltage: 1,8 V
Power Consumption Typical 1 W (depending on software)
Maximum 2 W (depending on software)
Thermal Commercial temperature: 0 ºC to +60 ºC
Industrial temperature: -40 ºC to +85 ºC
Form Factor 18 mm x 68.5 mm
Gumstix compatible
Humidity 93% relative Humidity at 40 ºC, non-condensing (according to IEC 60068-2-78)
MTBF > 100000 hours


Options

 
Processor
  • DM3730, by Texas Instruments
  • AM3703, by Texas Instruments
    ARM Cortex-A8
    Frequency speed 1000 MHz
Grade
  • Commercial temperature: 0 ºC to +60 ºC
  • Industrial temperature: -40 ºC to +85 ºC
Main Memory
  • 256 MB Mobile DDR
  • 512 MB Mobile DDR
Flash Memory
  • No flash
  • 256 MB
  • 512 MB
Wireless
  • No WiFi/Bluetooth
  • WiFi IEEE 802.11 b/g/n (Access Point: Yes)
    Bluetooth v4.0 (BLE)
3D/2D Accelerator - Video
  • Only DM3730

Documentation

Tutorials

  1. IGEP COM MODULE Boot Pin-out
  2. How to prepare a ready to boot firmware
  3. U-Boot Bootloader
  4. Linux Kernel
  5. IGEP Firmware set-up
  6. Boot from MicroSD Card
  7. Boot from NAND/eMMC flash.
  8. Update Installed IGEP Firmware

Firmware

Official

Software

Guides

Getting started with IGEP COM MODULE

Ubuntu / Debian

Yocto